Heat Spreader; Thermal Interface Materials - RadiSys PROCELERANT CE915GMA Product Manual

4
Thermal Solutions

Heat spreader

Thermal interface materials

42
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The CE-HSPA aluminium heat spreader is compliant with the PIGMG COM Express Base
Specification Revision 1.0. This heat spreader is specifically designed as an interface to
custom thermal solutions for all CE915GM modules.
This heat spreader can also be used by itself as a standalone thermal solution for the CE-
760A model, where there is a 25°C thermal margin when the ambient temperature
reaches 60°C.
W !
Do not use this heat speader with other CE915GM models as a standalone
ARING
thermal solution, as it will result in much lower thermal performance at a higher cost than
the other one-piece heatsink designs described in this chapter.
A thermal interface material (TIM) should be applied to the processor interface surfaces to
ensure maximum contact with the BGAs. Different thermal interface materials are
available.
• Good: Thermal Pad — a thick, clay-like gap filler limited to 10W TDP processors. For
information about the TDP of main thermal resources, see
page 21.
• Better: Thermal Grease — messy, but does not require a phase change cycle.
• Best: Phase Change Material — requires one 60°C thermal cycle to achieve full
performance. If your application requires the fastest CPU speed, a high ambient
temperature, and a workload at or exceeding the TDP, phase change material is
required.
RadiSys offers a phase-change thermal interface material (RadiSys product code CE-TIM),
which phase changes at 58°C.
Table 6 shows the recommended providers of thermal interface materials.
Manufacturer Part Number
Power devices Thermstrate-TC
Loctite Thermstrate-TC
For detailed instructions on how to apply the thermal interface material and install the
cooling system, refer to the Quick Start Guide.
Table 6. Recommended thermal interface materials
Description
Applicator bar, phase change TIM (thermal interface material)
Applicator bar, phase change TIM (thermal interface material)
Thermal design power on