Specifications - NXP Semiconductors NTAG I2C plus Explorer Kit Integration Manual

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3.3.
NTAG I
2
C Antenna Board OM5569/NT322E, Rev 2.0 (54 x 27 mm) –

specifications

Table 3: NTAG I
C plus Antenna Board OM5569/NT322E, Rev 2.0 (54 x 27 mm) –
2
specifications:
Antenna
Contactless operating frequency
Card reading/writing distance
Contactless (RF) Interface
Supported Interfaces (via 6-pin connector to NATG I2C Main Board)
I2C
Supported HW Functions (NTAG I2C ic)
FD
EH
Electrical and Mechanical Specifications
Power Supply
PCB Dimensions (L x W x
H)
Weight
Operating Temperature
Operating Humidity
Certificates
SRSt Template 1.0
Doc ID: DOC-XXXXXX
BL ID
PCB type, 54 mm x 27 mm
13.56 MHz
Up to 30 mm
NFC forum Type 2 Tag compliant with data transfer 106 Kbps
transmission rate
64 byte SRAM buffer for fast transfer of data between the RF and the
I2C interfaces
Unique 7 byte serial number (cascade level 2 according to ISO/IEC
14443-3)
True anticollision
I2C-bus interface to up to 100 kBd (Standard mode), up to 400 kBs
(Fast mode)
Field Detect function – wake up signal at the Field Detect pin
Energy Harvesting function for power external devices (low power
microcontroller)
NTAG I2C tag ic is powered from RF Field (from NFC phone)
70 mm x 38 mm x 7 mm
approx. 9 g
0 ... + 50 C (without condensing)
5 ... 95% RH
CE, FCC
Doc Rev 1.00 Approved — 2015.09.01
Project Name: Integration Manual Project ID: 62743
public
Hardware Manual
© NXP B.V. 2015. All rights reserved
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