NEC UPD789426 Series User Manual page 338

Table 23-1. Surface Mounting Type Soldering Conditions (3/3)
µ
(4) PD789425GK-×××-9ET-A: 64-pin plastic TQFP (12 × 12)
µ
PD789426GK-×××-9ET-A: 64-pin plastic TQFP (12 × 12)
µ
PD789435GK-×××-9ET-A: 64-pin plastic TQFP (12 × 12)
µ PD789436GK-×××-9ET-A: 64-pin plastic TQFP (12 × 12)
µ
PD789445GK-×××-9ET-A: 64-pin plastic TQFP (12 × 12)
µ PD789446GK-×××-9ET-A: 64-pin plastic TQFP (12 × 12)
µ
PD789455GK-×××-9ET-A: 64-pin plastic TQFP (12 × 12)
µ
PD789456GK-×××-9ET-A: 64-pin plastic TQFP (12 × 12)
µ
PD789425GB-×××-8EU-A: 64-pin plastic LQFP (10 × 10)
µ
PD789426GB-×××-8EU-A: 64-pin plastic LQFP (10 × 10)
µ PD789435GB-×××-8EU-A: 64-pin plastic LQFP (10 × 10)
µ
PD789436GB-×××-8EU-A: 64-pin plastic LQFP (10 × 10)
µ
PD789445GB-×××-8EU-A: 64-pin plastic LQFP (10 × 10)
µ
PD789446GB-×××-8EU-A: 64-pin plastic LQFP (10 × 10)
µ
PD789455GB-×××-8EU-A: 64-pin plastic LQFP (10 × 10)
µ PD789456GB-×××-8EU-A: 64-pin plastic LQFP (10 × 10)
µ
PD78F9436GK-9ET-A: 64-pin plastic TQFP (12 × 12)
µ
PD78F9456GK-9ET-A: 64-pin plastic TQFP (12 × 12)
µ
PD78F9436GB-8EU-A: 64-pin plastic LQFP (10 × 10)
µ
PD78F9456GB-8EU-A: 64-pin plastic LQFP (10 × 10)
Soldering Method
Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C or higher),
Infrared reflow
Count: Three times or less, Exposure limit: 7 days
for 20 to 72 hours)
Wave soldering When the pin pitch of the package is 0.65 mm or more, wave soldering can also be
performed.
For details, contact an NEC Electronics sales representative.
Partial heating Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
Caution Do not use different soldering methods together (except for partial heating).
CHAPTER 23 RECOMMENDED SOLDERING CONDITIONS
Soldering Conditions
User's Manual U15075EJ2V1UD
Note
(after that, prebake at 125°C
Recommended
Condition Symbol
IR60-207-3
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