Major Components (Ics) - ADLINK Technology LEC-BTS Technical Reference

1.2

Major Components (ICs)

Table 1-1 lists the major integrated circuits on the LEC-BTS, including a brief description of each
IC. Figures 1-2 and 1-3 show the locations of the major ICs.
Table 1-1: Major Integrated Circuit Descriptions and Functions
Chip Type
CPU (U1) Intel
Ethernet Intel
Controller (U9
[bottom])
DDR3L Micron
SDRAM (U24
[bottom], U25,
U26 [top], U27
[bottom])
Key:
U1 - CPU
U25 - DDR3L SDRAM
U26 - DDR3L SDRAM
2
Mfg. Model
• E3805 (dual core, 3W,
headless, 1.33GHz)
• E3815 (single core, 5W,
1.46GHz)
• E3826 (dual core,
7W, 1.46GHz)
• E3845 (quad core, 10W,
1.91GHz)
• N2807 (dual core, 4.3W,
1.58Ghz)
WGI210IT SLIXT
MT41K256M16HA-125
U26
U25
Figure 1-2: Component Locations (Top Side)
Description
Atom, 22nm SoC
(System on Chip) with
Intel 64 Architecture
Celeron, 22nm SoC
(System on Chip) with
Intel 64 Architecture
Single-port Gigabit
Ethernet controller
On-board DDR3L,
1.35V, 4Gb,
32Mx16x8, non-ECC,
un-buffered System
Memory
U1
P74
Function
Integrates
Processor Core,
Graphics and
Memory Controller
Hub, and I/O Hub
Integrates GbE
MAC, PHY, and
SGMII/SerDes to
enable
10T/100TX/1000T
Ethernet signals
using the PCIe x1
bus
Provides
high-speed data
transfer
P156
Overview