Quectel EM06 Series Manual page 63

The thermal dissipation area, where the thermal pad is added, is shown as below. The dimensions are
measured in mm.
Figure 30: Thermal Dissipation Area on Bottom Side of Module (Top View)
There are some other measures to enhance heat dissipation performance:
⚫
Add as many ground vias as possible on the PCB.
⚫
Maximize the airflow over/around the module.
⚫
Place the module away from other heating sources.
⚫
Module mounting holes must be used to attach (ground) the device to the main PCB ground.
⚫ It is NOT recommended to apply solder mask on the main PCB where the module's thermal
dissipation area is located.
⚫
To facilitate thermal dissipation, select an appropriate piece of material with suitable thickness and
surface for the outer housing (i.e. the mechanical enclosure) of the application device that integrates
the module.
⚫
Use active cooling method when necessary to pull heat away from the module.
⚫
Add a heatsink on the top of the module when possible. In that case, a thermal pad should be used
between the heatsink and the module with the former being designed to have as many fins as
possible to increase the heat dissipation area.
NOTE
For more detailed guidelines on thermal design, see document [5].
EM06_Series_Hardware_Design
LTE-A Module Series
EM06 Series Hardware Design
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