Temperature And Humidity; Cleanliness; Cooling System - H3C SecPath F100-C-A-W Installation Manual

Temperature and humidity

Maintain appropriate temperature and humidity in the equipment room.
•
Lasting high relative humidity can cause poor insulation, electricity leakage, mechanical
property change of materials, and metal corrosion.
•
Lasting low relative humidity can cause washer contraction and ESD and bring problems
including loose captive screws and circuit failure.
•
High temperature can accelerate the aging of insulation materials and significantly lower the
reliability and lifespan of the firewall.
For the temperature and humidity requirements of the firewall, see Table1-1.
Table1-1 Temperature/humidity requirements
Item
Ambient temperature
Ambient humidity

Cleanliness

Dust buildup on the chassis might result in electrostatic adsorption, which causes poor contact of
metal components and contact points, especially when indoor relative humidity is low. In the worst
case, electrostatic adsorption can cause communication failure.
Table1-2 Dust concentration limit in the equipment room
Substance
Dust particles
NOTE:
Dust particle diameter ≥ 5 µm
The equipment room must also meet strict limits on salts, acids, and sulfides to eliminate corrosion
and premature aging of components, as shown in Table1-3.
Table1-3 Harmful gas limits in an equipment room
Gas
SO
2
H S
2
NH
3
Cl
2
NO
2

Cooling system

The firewall uses natural cooling. For adequate cooling of the firewall, follow these guidelines:
•
Reserve a minimum clearance of 100 mm (3.94 in) around the outlet air vents.
•
Make sure the installation site has a good cooling system.
Specification
•
Operating: 0°C to 45°C (32°F to 113°F)
•
Storage: –40°C to +70°C (–40°F to +158°F)
5% RH to 95% RH, noncondensing
Concentration limit (particles/m
≤ 3 × 10 4
(No visible dust on desk in three days)
3
Max. (mg/m )
0.2
0.006
0.05
0.01
0.04
3
3
)