Thermal Management; Heatspreader - Kontron nanoETXexpress-SP User Manual

Hide thumbs Also See for nanoETXexpress-SP:

Table of Contents

3.9

Thermal Management

A heatspreader plate assembly is available from Kontron Embedded Modules for the nanoETXexpress-SP. The heatspreader

plate on top of this assembly is NOT a heat sink. It works as a COM Express®-standard thermal interface to use with a heat

sink or other cooling device.

External cooling must be provided to maintain the heatspreader plate at proper operating temperatures. Under worst-

case conditions, the cooling mechanism must maintain an ambient air and heatspreader plate temperature of 60° C or

less.

The aluminum slugs and thermal pads on the underside of the heatspreader assembly implement thermal interfaces

between the heatspreader plate and the major heat-generating components on the nanoETXexpress-SP. About 80 percent

of the power dissipated within the module is conducted to the heatspreader plate and can be removed by the cooling

solution.

You can use many thermal-management solutions with the heatspreader plates, including active and passive approaches.

The optimum cooling solution varies, depending on the COM Express® application and environmental conditions. Please

see the COM Express® Design Guide for further information on thermal management.

3.10

Documentation and CAD drawings of nanoETXexpress-SP heatspreader and cooling solutions is provided at

http://emdcustomersection.kontron.com.

Table of Contents