Reflow Parameters - Laird BL600-SA Hardware Integration Manual

Single mode bluetooth low energy (ble) module
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BL600-Sx Hardware Integration Guide
Single Mode BLE Module

8.3 Reflow Parameters

Prior to any reflow, it is important to ensure the modules were packaged to prevent moisture absorption.
New packages contain desiccate (to absorb moisture) and a humidity indicator card to display the level
maintained during storage and shipment. If directed to
instructions specified by IPC/JEDEC J-STD-033. A copy of this standard is available from the JEDEC website:
http://www.jedec.org/sites/default/files/docs/jstd033b01.pdf
Note:
The shipping tray cannot be heated above 65°C. If baking is required at the higher temperatures
displayed in in
Any modules not manufactured before exceeding their floor life should be re-packaged with fresh desiccate
and a new humidity indicator card. Floor life for MSL (Moisture Sensitivity Level) 3 devices is 168 hours in
ambient environment
Table 20: Recommended baking times and temperatures
125°C
Baking Temp.
Saturated
@ 30°C/85%
MSL
3
9 hours
Laird surface mount modules are designed to be easily manufactured, including reflow soldering to a PCB.
Ultimately it is the responsibility of the customer to choose the appropriate solder paste and to ensure oven
temperatures during reflow meet the requirements of the solder paste. Laird surface mount modules conform
to J-STD-020D1 standards for reflow temperatures.
Important: During reflow, modules should not be above 260° and not for more than 30 seconds.
Figure 8-2: Recommended Reflow Temperature
Temperatures should not exceed the minimums or maximums presented in
Americas: +1-800-492-2320 Option 2
Europe: +44-1628-858-940
Hong Kong: +852-2923-0610
www.lairdtech.com/bluetooth
Table
20, the modules must be removed from the shipping tray.
30°C/60%RH.
Floor Life Limit
Saturated
+ 72 hours
@ 30°C/85%
@ 30°C/60%
7 hours
33 hours
bake units
on the card, see
90°C/≤ 5%RH
Baking Temp.
Floor Life Limit
+ 72 hours
@ 30°C/60%
23 hours
42
Table 20
and follow
40°C/ ≤ 5%RH
Baking Temp.
Floor Life Limit
Saturated
+ 72 hours @
@ 30°C/85%
30°C/60%
13 days
9 days
Table
21.
CONN-HIG-BL600

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