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BT800 Hardware Integration Guide
Version 0.2
14 A
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PPLICATION
OTE FOR
14.1
Introduction
Laird Technologies surface mount modules are designed to conform to all major manufacturing
guidelines. This application note is intended to provide additional guidance beyond the information
that is presented in the User Manual. This Application Note is considered a living document and will be
updated as new information is presented.
The modules are designed to meet the needs of a number of commercial and industrial applications.
They are easy to manufacture and conform to current automated manufacturing processes.
14.2
Shipping tray
Modules are shipped in ESD (Electrostatic Discharge) safe trays that can be loaded into most
manufacturers pick and place machines. Layouts of the trays are provided in.
Figure 20: Shipping tray layout
14.3
Reflow Parameters
Laird Technologies surface mount modules are designed to be easily manufactured, including reflow
soldering to a PCB. Ultimately it is the responsibility of the customer to choose the appropriate solder
paste and to ensure oven temperatures during reflow meet the requirements of the solder paste. Laird
Technologies' surface mount modules conform to J-STD-020D1 standards for reflow temperatures.
Important: During reflow, modules should not be above 260° and not for more than 30 seconds.
Americas: +1-800-492-2320 Option 2
Europe: +44-1628-858-940
Hong Kong: +852-2923-0610
www.lairdtech.com/bluetooth
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CONN-GUIDE-BT800_v0_2
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