BTM410/411 Bluetooth ® AT Data Module Hardware Integration Guide EVISION ISTORY Revision Date Description 1 March 2012 Initial Release 12 March 2012 General updates and compliant with firmware v16.1.3.0 13 April 2012 Reformatting and general edits Reformatting. Addition of Table 2-6. Reference to Table 2-6 in Table 2-1.
VERVIEW AND EATURES The BTM410 and BTM411 Bluetooth® modules from Laird are designed to meet the needs of developers who wish to add robust, short range Bluetooth data connectivity to their products. These modules are based on the market leading Cambridge Silicon Radio BC04 chipset, providing exceptionally low power consumption with outstanding range.
Channels 79 channels Frequency Hopping Adaptive Frequency Hopping Max. Transmit Power +4 dBm at antenna pad – BTM410 +4 dBmi from integrated antenna – BTM411 Min. Transmit Power -27 dBm at antenna pad – BTM410 -27 dBmi from integrated antenna – BTM411...
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Interface Surface Mount Pads External Antenna (BTM410) Pad for 50 Ohm antenna Physical Dimensions 12.5 mm x 18.0 mm x 3.4 mm BTM410 12.5 mm x 22.0 mm x 3.4 mm BTM411 Weight 3 grams Environmental Operating Temperature -40° C to +85° C Storage Temperature -40°...
I/O for host Unused Unused See note 3 Unused See note 3 Unused See note 3 GND (BTM410 only) See note 3 ANT (BTM410 only) Antenna connection (50 ohm matched) See note 3 GND (BTM410 only) See note 3 Unused...
Reset input is active low. Input is pulled up to VDD_IN via 22k. Minimum reset pulse width is 5 ms. Pins 8 – 11 (SPI related) are only for Laird internal production purposes. Pins 25-37 should be left not connected on modules with integrated antenna.
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BTM410/411 ® Bluetooth AT Data Module Hardware Integration Guide Table 2-5: Voltage specifications (VIO) Input Voltage Levels 0.7VDD_IO Vil 2.7<VDD_USB<3.0 -0.4 +0.8 1.7<VDD_USB<1.9 -0.4 -0.4 Output Voltage Levels (1.7 < VDD_IO < 1.9) Voh (Iout = -4 mA) VDD_USB – 0.4 Vol (Iout = 4 mA) Output Voltage Levels (2.7 <...
≤ 60/f(GHz) i.e. 25mW for a 2.4Ghz device. The Maximum Power Exposure for the BTM410 has been evaluated and found to comply with the low power threshold for an uncontrolled environment.
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BTM410/411 ® Bluetooth AT Data Module Hardware Integration Guide BTM411 FCC and Industry Canada Statements The user manual must show the following statements: This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
4.1.2 Declaration We, Laird Technologies, declare under our sole responsibility that the essential radio test suites have been carried out and that the above product to which this declaration relates is in conformity with all the applicable essential requirements of Article 3 of the EU Directive 1995/5/EC, when used for its intended purpose.
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4.2.2 Declaration: We, Laird Technologies, declare under our sole responsibility that the essential radio test suites have been carried out and that the above product to which this declaration relates is in conformity with all the applicable essential requirements of Article 3 of the EU Directive 1995/5/EC, when used for its intended purpose.
BTM410 Mechanical Details Note: An area of 1.5 mm around the module should be reserved as a keep-out area. Development Kit Schematics can be accessed here: Development Kit Schematics – BTM410 / BTM411 Americas: +1-800-492-2320 Option 2 CONN-HIG-BTM410-411 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth...
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An area of 1.5 mm around the module should be reserved as a keep-out area. No other components should be placed in this area. Development Kit Schematics can be accessed here: Development Kit Schematics – BTM410 / BTM411 Americas: +1-800-492-2320 Option 2 CONN-HIG-BTM410-411...
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WARNING: Test point dimensions are for reference only. DO NOT make electrical connections to these test points, this will void the warranty. Laird does not recommend routing on the top layer underneath the module. Development Kit Schematics can be accessed here: Development Kit Schematics –...
BTM410/411 ® Bluetooth AT Data Module Hardware Integration Guide BTM411 Mechanical Details Note: An area of 1.5 mm around the module should be reserved as a keep-out area. Americas: +1-800-492-2320 Option 2 CONN-HIG-BTM410-411 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth...
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Bluetooth AT Data Module Hardware Integration Guide Development Kit Schematics can be accessed here: Development Kit Schematics – BTM410 / BTM411 BTM411 Mechanical Details Note: An area of 1.5 mm around the module should be reserved as a keep-out area.
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Bluetooth AT Data Module Hardware Integration Guide Development Kit Schematics can be accessed here: Development Kit Schematics – BTM410 / BTM411 BTM411 Mechanical Details Note: An area of 1.5 mm around the module should be reserved as a keep-out area.
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BTM411 Mechanical Details DO NOT WARNING: Test point dimensions are for reference only. make electrical connections to these test points, this will void the warranty. Laird does not recommend routing on the top layer underneath the module. Americas: +1-800-492-2320 Option 2 CONN-HIG-BTM410-411...
ODULES Introduction Laird’s surface mount modules are designed to conform to all major manufacturing guidelines. This section is intended to provide additional guidance beyond the information that is presented elsewhere. This section is considered a living document and will be updated as new information presents.
AT Data Module Hardware Integration Guide Reflow Parameters Laird’s surface mount modules are designed to be easily manufactured, including reflow soldering to a PCB. Ultimately it is the responsibility of the customer to choose the appropriate solder paste and to ensure oven temperatures during reflow meet the requirements of the solder paste.
Development board with BTM411 module soldered in place General Comments Please check with Laird Technologies for the latest information before commencing a design. If in doubt, ask. Refer to the schematic BTDMD-R-001.pdf for the Development Kit on the following two pages for examples of typical pin connections.
Your new Design will be listed on the SIG website and you can print your Certificate and DoC. For further information please refer to the following training material: https://www.bluetooth.org/en-us/test-qualification/qualification-overview/listing-process-updates Additional Assistance Please contact your local sales representative or our support team for further assistance: Laird Technologies Connectivity Products Business Unit Support Centre: http://ews-support.lairdtech.com Email: wireless.support@lairdtech.com...
Bluetooth AT Data Module Hardware Integration Guide ELATED OCUMENTS AND ILES The following additional BTM410/411 technical documents are also available from the Laird BTM41x Series product page under the Documentation tab: Product Brief User Guide - Version 6.0 ...
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