Reflow Parameters - Laird BT800 Series Hardware Integration Manual

BT800-ST Hardware Integration Guide
Version 1.5

13.3 Reflow Parameters

Laird surface mount modules are designed to be easily manufactured, including reflow soldering to a PCB.
Ultimately it is the responsibility of the customer to choose the appropriate solder paste and to ensure oven
temperatures during reflow meet the requirements of the solder paste. Laird's surface mount modules conform to J-
STD-020D1 standards for reflow temperatures.
Important: During reflow, modules should not be above 260° and not for more than 30 seconds.
Figure 13-22: Recommended Reflow Temperature
Temperatures should not exceed the minimums or maximums presented in
Table 18: Recommended Maximum and minimum temperatures
Specification
Temperature Inc./Dec. Rate (max)
Temperature Decrease rate (goal)
Soak Temp Increase rate (goal)
Flux Soak Period (Min)
Flux Soak Period (Max)
Flux Soak Temp (Min)
Flux Soak Temp (max)
Time Above Liquidous (max)
Time Above Liquidous (min)
Time In Target Reflow Range (goal)
Time At Absolute Peak (max)
Liquidous Temperature (SAC305)
Lower Target Reflow Temperature
Upper Target Reflow Temperature
Absolute Peak Temperature
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Table
Value Unit
1~3 °C / Sec
2-4 °C / Sec
.5 - 1 °C / Sec
70 Sec
120 Sec
150 °C
190 °C
70 Sec
50 Sec
30 Sec
5 Sec
218 °C
240 °C
250 °C
260 °C
31
18.
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