Laird BT740-SA Hardware Integration Manual
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Laird BT740-SA Hardware Integration Manual

Enhanced class 1 bluetooth v2.1 module
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Smart Technology. Delivered.
Enhanced Class 1
Bluetooth v2.1 Module
H
I
G
ARDWARE
NTEGRATION
UIDE
V
1.3
ERSION
Part # BT740-SA, BT740-SC
Americas: +1-800-492-2320 Option 2
Europe: +44-1628-858-940
Hong Kong: +852-2923-0610
www.lairdtech.com/bluetooth

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  • Page 1 Smart Technology. Delivered. Enhanced Class 1 Bluetooth v2.1 Module ARDWARE NTEGRATION UIDE ERSION Part # BT740-SA, BT740-SC Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth...
  • Page 2 Enhanced Class 1 Bluetooth v2.1 Module Hardware Integration Guide Revision History Approved By Revision Revision Date Description Jonathan Kaye 30 July 2013 Initial Release Jonathan Kaye 30 Sept 2013 Removed yellow highlights Jonathan Kaye 19 Dec 2013 Fixed typo. Jonathan Kaye 06 Feb 2014 Updated Bluetooth SIG Qualification section.

  • Page 3: Table Of Contents

    Enhanced Class 1 Bluetooth v2.1 Module Hardware Integration Guide Contents Overview and Key Features ........................4 Specifications ............................5 Hardware Specifications ........................... 7 I/O Characteristics ..........................12 Functional Description ..........................13 Hardware Integration Suggestions ......................15 Mechanical Details ..........................18 Surface Mount Modules .........................

  • Page 4: Overview And Key Features

    Every BT740 series Bluetooth ® module from Laird is designed to add robust, long-range Bluetooth data connectivity to any device. Based on the market-leading Cambridge Silicon Radio (CSR) BC04 chipset, BT740 modules provide exceptionally low power consumption with outstanding Class 1 range via 18 dBm of transmit power.

  • Page 5: Specifications

    2.402 - 2.480 GHz Bluetooth Transmitter Class Class 1 (Basic Rate BT) Max Transmit Power 18 dBm into integrated antenna (BT740-SA) 16 dBm into UFL antenna connector (BT740_SC) Min Transmit Power -9 dBm into integrated antenna -9 dBm into UFL antenna connector Receive Sensitivity Better than -87 dBm (at 25°...
  • Page 6 6 mA (no data transfer) Connected mode 35 mA (max data transfer) Sniff mode 1.8 mA Internal Multilayer ceramic - BT740-SA Antenna Options External Connection via u.FL - BT740-SC Connections Surface Mount Pads (1.2mm pitch) Physical Dimensions 15.29 mm x 28.71 mm x 2.5 mm Weight 1.5 g...

  • Page 7: Hardware Specifications

    Enhanced Class 1 Bluetooth v2.1 Module Hardware Integration Guide ARDWARE PECIFICATIONS 3.1 Hardware Specifications Figure 3-1: Functional Block Diagram Figure 3-2: BT740-Sx module pin-out (Top View) CONN-HIG-BT740 Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth...
  • Page 8 Pins 2, 6, 32, and 33 (SPI related) are for Laird internal production purposes. Power-on-reset (power cycling and brown out consideration) – The reset circuitry within the BT740 module incorporates a brown-out detector; this may simplify power supply design. The BT430 reset line is an active low input (Input debounced so must be low for more than 5 ms to cause a reset).
  • Page 9 Enhanced Class 1 Bluetooth v2.1 Module Hardware Integration Guide Power Supply Consideration – The power supply for the module should be a single voltage source of VCC within the VCC_IN range of 3.3 V to 5.0 V. It must be able to provide sufficient current in a transmit burst.
  • Page 10 Enhanced Class 1 Bluetooth v2.1 Module Hardware Integration Guide 3.3 Electrical Specifications 3.3.1 Absolute Maximum Ratings Absolute maximum ratings for supply voltage and voltages on digital and analogue pins of the module are listed below. WARNING: Exceeding the following values causes permanent damage to the device. Parameter Unit Peak current of power supply...
  • Page 11 UART_DCD I or O Direction may be programmed. 3.3.2.4 SPI Bus Signal Name Pin No Comments SPI_MOSI SPI_MISO INTERNAL USE ONLY - Used to reprogram Flash in Laird production. SPI_CSB SPI_CLK 3.3.2.5 PCM Interface Signal Name Pin No Comments PCM_CLK...

  • Page 12: O Characteristics

    4.2 Typical Current Consumption in mA Table 4-1: Current Consumption VCC_IN = 3.8 V, Baudrate = 9600 bps Typical Average Current (mA) Separation Distance = 15 meters ( two BT740-SA) Idle Mode, S512=1 1.25 mA Wait for Connection Or Discoverable Mode,...

  • Page 13: Functional Description

    Enhanced Class 1 Bluetooth v2.1 Module Hardware Integration Guide UNCTIONAL ESCRIPTION The BT740 Bluetooth module is a self-contained Bluetooth product and requires only power to implement full Bluetooth communication. The integrated, high performance antenna, together with the RF and base-band circuitry provides the Bluetooth link and the UART interface provides a connection to the host system.
  • Page 14 The module is a slave device that uses terminals SPI_MOSI, SPI_MISO, SPI_CLK, and SPI_CSB. This interface is used for program firmware updates ONLY at the factory. Laird supplies a PC-based utility to allow a firmware upgrade over the UART port. Laird highly recommends that customers use this method for updating firmware.

  • Page 15: Hardware Integration Suggestions

    VCC_IN pin. 6.2 PCB Layout on Host PCB - General Checklist (for PCB): MUST locate the BT740-SA module close to the edge of PCB (mandatory for BT740-SA for on-board  chips antenna to radiate properly).
  • Page 16 6.3.1 Antenna keep-out on host PCB The BT740-SA has an integrated chip antenna and its performance is sensitive to the host PCB. It is critical to locate the BT740-SA on the edge of the host PCB (or corner) to allow the antenna to radiate properly. Refer...
  • Page 17 Enhanced Class 1 Bluetooth v2.1 Module Hardware Integration Guide Note: Copper cut-away on all layers in “antenna keep-out” area under BT740-SA module on host PCB. 7.4 PCB Land Pattern and Antenna Keep-out for BT740-SA. Refer to “antenna keep-out” defined in 6.3.2 Antenna Keep-out and Proximity to Metal or Plastic...

  • Page 18: Mechanical Details

    Enhanced Class 1 Bluetooth v2.1 Module Hardware Integration Guide Note 1: Integral RF co-axial cable with UFL connector. Antenna manufacturer Laird contact information: Email: wireless.support@lairdtech.com ECHANICAL ETAILS 7.1 BT740-SC Mechanical Details Figure 7-1: BT740-SC mechanical details 7.2 BT740-SA Mechanical Details...
  • Page 19 Enhanced Class 1 Bluetooth v2.1 Module Hardware Integration Guide 7.3 BT740 Pad Definitions – Mechanical Drawing Figure 7-3: BT7xx Mechanical Drawing CONN-HIG-BT740 Americas: +1-800-492-2320 Option 2 Europe: +44-1628-858-940 Hong Kong: +852-2923-0610 www.lairdtech.com/bluetooth...
  • Page 20 PCB, preferably in the corner with the antenna facing the corner (see Figure 6-1). The module is placed in the corner of host PCB above the keep-out area. If the BT740-SA is placed on the edge instead, the keep-out area must be modified (see Figure 6-2 in section 6.3.1).

  • Page 21: Surface Mount Modules

    ODULES 8.1 Introduction Laird surface mount modules are designed to conform to all major manufacturing guidelines. This section provides additional guidance for mounting the module. This section is considered a living document and is updated as new information is presented.
  • Page 22 Hardware Integration Guide 8.3 Reflow Parameters Laird surface mount modules are designed to be easily manufactured, including reflow soldering to a PCB. Ultimately it is the responsibility of the customer to choose the appropriate solder paste and to ensure oven temperatures during reflow meet the requirements of the solder paste.

  • Page 23: Fcc Regulatory Statements

    Customers who want to use the BT740 in portable applications require further RF evaluation. Contact a qualified test house or a Laird representative for further information on this topic (reference FCC Part 2.1093 for further details on portable devices).
  • Page 24 CAUTION: The OEM should have the device incorporating with the BT740 tested by a qualified test house to verify compliance with FCC Part 15 Subpart B limits for unintentional radiators. CAUTION: Any changes or modifications not expressly approved by Laird could void the user’s authority to operate the equipment.
  • Page 25 Enhanced Class 1 Bluetooth v2.1 Module Hardware Integration Guide The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.
  • Page 26 The BT740 was tested with a 2dBi dipole antenna. The OEM is free to use any manufacturer’s antenna and type of antenna but it must be <2dBi to remain in compliance with the Laird reports. Reference the Declaration of Conformities listed below for a full list of the standards that the modules were tested to.

  • Page 27: Eu Declarations Of Conformity

    Declaration: We, Laird Inc., declare under our sole responsibility that the essential radio test suites have been carried out and that the above product to which this declaration relates is in conformity with all the applicable essential requirements of Article 3 of the EU Directive 1995/5/EC, when used for its intended purpose.
  • Page 28 Declaration: We, Laird Inc., declare under our sole responsibility that the essential radio test suites have been carried out and that the above product to which this declaration relates is in conformity with all the applicable essential requirements of Article 3 of the EU Directive 1995/5/EC, when used for its intended purpose.

  • Page 29: Bluetooth Sig Approvals

    Bluetooth SIG website. In the instance of subsystems, a member can combine two or more subsystems to create a complete Bluetooth End Product solution. Subsystem listings referenced as an example: Design Declaration Owner Link to listing on the SIG website Name BT740 Laird B020701 https://www.bluetooth.org/tpg/QLI_viewQDL.cfm?qid=20701 Interface Cambridge B017578 https://www.bluetooth.org/tpg/QLI_viewQDL.cfm?qid=17578 Express Consultants subsystem 11.2 Assumptions...

  • Page 30: Ordering Information

    Your new Design will be listed on the SIG website and you can print your Certificate and DoC. For further information please refer to the following training material: https://www.bluetooth.org/en-us/test-qualification/qualification-overview/listing-process-updates 11.3 Additional Assistance Please contact your local sales representative or our support team for further assistance: Laird Technologies Connectivity Products Business Unit Support Centre: http://ews-support.lairdtech.com Email: wireless.support@lairdtech.com...
  • Page 31 DVK – BT740-SC Development board with BT740-SC module soldered in place 12.1 General Comments This is a preliminary datasheet. Please check with Laird for the latest information before commencing a design. If in doubt, ask. CONN-HIG-BT740 Americas: +1-800-492-2320 Option 2...
  • Page 32 The information contained in this manual and the accompanying software programs are copyrighted and all rights are reserved by Laird, Inc. Laird, Inc. reserves the right to make periodic modifications of this product without obligation to notify any person or entity of such revision.

This manual is also suitable for:

Bt740-sc

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