50-Ohms Rf Trace On Host Pcb For Bl600-St - Laird BL600-SA Hardware Integration Manual

BL600-Sx Hardware Integration Guide
Single Mode BLE Module

6.4 50-Ohms RF trace on Host PCB for BL600-ST

Checklist (for PCB):
RF_ANT pin (pin30) is on the BL600-ST module only. You MUST use a 50-Ohm trace from RF_ANT pin to

RSMA RF antenna connector on host PCB.
Figure 11 shows the 10 mm length 50-Ohms RF trace (implemented as GCPW) from the BL600-ST module RF
trace pads (GND, RF_ANT, GND) on BL600 development board.
BL600-ST module
Pin30 RF_ANT trace
pad.
Figure 11: 50-Ohm trace design on BL600 development board (or host PCB) for use with BL600-ST module.
To ensure compliance, observe the following considerations for 50-Ohms RF trace design and test verification:
Follow the 50-Ohms trace design used on the BL600 development board (PCB stack-up in

this PCB-stack-up is not practical on customer design then design 50-Ohms for differing PCB stack-up.
Use the same PCB material (FR4)

The 50-Ohms trace should be a controlled-impedance trace e.g. ±10%.

The 50-Ohms RF trace length should be 10 mm (recommended) as on the BL600 development board to

reduce the trace length.
Use the same 50-Ohm track width. BL600-ST module RF_ANT pad and land pad widths are 0.5 mm.

Therefore 50-Ohm RF trace width may be 0.5 mm width. If 50-Ohm trace is wider, a tapered section
should be designed to gradually go from wider width to 0.5 mm RF_ANT (land pad) width.
Place GND vias regularly spaced either side of 50-Ohms trace to form GCPW (Grounded coplanar

waveguide) transmission line.
Use spectrum analyser to confirm the radiated (and conducted) signal is within the certification limit.

To copy the BL600 development board 50-Ohms RF trace:
Use the same PCB material (FR4)

0.5 mm track width

Use the same board L1 to L2 thickness (0.2032 mm = 8Mil) for 50-Ohms impedance RF trace design.

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Figure 10). If
CONN-HIG-BL600