Closing The Device - Teldat H1 RAIL Series Installation Manual

Teldat S.A.
(4) Return the tray to its original position.
(5) While pressing on the tray, push the fastening towards the inside of the tray (LOCK).
(6) The card should be completely held by the tray.

2.2.3 Closing the device

After installing the SIM card, you can then close the device. To do this, carry out the steps used to open the device in
reverse order paying special attention to communication modules' Thermal Pad.
This element must be placed over the communication modules to expel the heat from the module outside through the
device metal casing; the module should be in contact with the casing.
This Pad quite often sticks to the casing when you open up the device simply due to its rubbery consistency as no
adhesive is used.
Due to this, and in order to assemble the device again, you need to carry out the following steps:
(1) Check that the Thermal Pad is located on top of the module. If it isn't, check to see if it's stuck to the casing. If it
is, remove from the casing and place on top of the module.
(2) Refit the lid, first sliding it horizontally and then vertically so as not to 'drag' it over the Pad.
(3) Replace the seven screws holding the cover.
Example of a Thermal Pad assembled over the WWAN MD1. This must be assembled in both.
Fig. 11:
Teldat H1 RAIL
2 Installation
11