Ordering Parts; Soldering Techniques; Installation; Replacement Procedures - Tektronix 1S1 Instruction Manual

Maintenance – Type 1S1
Tektronix, or are selected by Tektronix to meet specific
performance requirements. Each of these special parts is
indicated in the Parts List by an asterisk preceding the part
number. In addition, most of the mechanical parts used in
this instrument have been manufactured by Tektronix. Order
all special parts directly from your Tektronix Field Office
or representative.

Ordering Parts

When ordering replacement parts from Tektronix, always
include the following information:
1. A complete description of the part as given in the
Parts List. If it is an electrical part, also give its circuit
number.
2. The instrument type (Type 1S1).
3. The instrument Serial Number.

Soldering Techniques

Etched-Wiring Boards. Use ordinary 60/40 tin-lead
solder with a 35- to 40-watt pencil-type soldering iron.
A hotter type of iron may separate the etched-wiring ma-
terial from the laminate base. The tip of the iron should be
clean and properly tinned for quick heat transfer to the
solder joint. The following technique is suggested for re-
placing a component on an etched-wiring board:
Removal:
1. Grip one lead of the component with a pair of long-
nosed pliers or a pair of tweezers. (If the component is
known to be defective, the leads may be cut near the body
of the component for individual removal.)
2. Touch the tip of the soldering iron to the lead at the
solder connection (see Fig. 4-1). When the solder begins
to melt, pull the lead out gently.
3. Remove each of the other leads in the some manner.

Installation:

1. Bend the leads of the new components to match the
holes in the board. If the holes are not open, they can be
opened by heating the solder to the melting point and
quickly inserting a pointed tool or toothpick into the hole.
2. Clip the lead lengths of the new component to the
same lengths as the leads of the component that was re-
moved.
3. Insert the leads into the board and position the com-
ponent properly with respect to the board.
4. Heat-shunt each lead by holding it with long-nosed
pliers while applying a small amount of solder to the con-
nection.
5. Clean the area around the solder connection with a
flux-removing solvent. Be careful not to remove any infor-
mation printed on the efched-wiring board.
4-2
Metal Terminals. When soldering to metal terminals
such as connector jacks and switch terminals, ordinary 60/40
tin-lead solder can be used. The soldering iron should have
a 40- to 75-watt rating and a
Observe the following precautions:
1. Apply only enough heat to make the solder flow
freely.
2. If the leads of small components are being soldered
to the terminals, be sure to heat-shunt the leads with long-
nosed pliers.
3. Apply only enough solder to form a solid connection.
Excess solder may impair the function of the part.
4. If excess wire extends beyond the completed solder
joint, clip it off and remove it.
Fig. 4-1. Apply soldering iron to the heat-shunted lead when re-
moving a component from an etched-wiring board.

Replacement Procedures

Etched-Wiring Board Removal. If one of the etched-
wiring boards is damaged and cannot be repaired, the board
will need to be replaced. When replacing a defective board,
the entire assembly including the soldered-on components
should be replaced. Part numbers for the replacement
board assemblies are given in the mechanical Parts List.
The following procedure is suggested for replacing the
etched-wiring boards:
Removal:
1. Disconnect all coax mini-jack connectors (if any) from
the board.
2. If the Vertical board is being replaced, remove the
shield covering the blocking-oscillator circuit (Q80 and
SNAP-OFF CURRENT control R85) and remove the two tubes
extending through the chassis.
3. Heat-shunt and unsolder all wires connected to the
board.
4. Remove all screws holding the board to the chassis
frame.
5. Lift the etched-wiring board out of the instrument. Do not
force or bend it.
th-inch chisel-shaped tip.