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PROCESSOR TECHNOLOGY CORPORATION
CUTS, COMPUTER USERS TAPE SYSTEM
APPENDIX IV
LOADING DIP (DUAL IN-LINE PACKAGE) DEVICES
Most DIP devices have their leads spread so that they can not be
dropped straight into the board.
They must be "walked in" using the
following procedure:
(1) Orient the device properly.
Pin 1 is indicated by a small
embossed dot on the top surface of the device at one corner.
Pins are numbered counterclockwise from pin 1.
(2) Insert the pins on one side of the device into their holes on
the printed circuit card.
Do not press the pins all the way
in, but stop when they are just starting to emerge from the
opposite side of the card.
(3) Exert a sideways pressure on the
pin~
at the other side of
the device by pressing against them where they are still wide
below the bend.
Bring this row of pins into alignment with
its holes in the printed circuit card and insert them an
equal distance, until they begin to emerge.
(4) Press the device straight down until it seats on the points
where the pins widen.
(5) Turn the card over and select two pins at opposite corners of
the device.
Using a fingernail or a pair of long-nose
pliers, push these pins outwards until they are bent at a 45
0
angle to the surface of the card.
This will secure the de-
vice until it is soldered.
SOLDERING TIPS
(1) Use a low-wattage iron--25 watts is good.
Larger irons run
the risk of burning the printed-circuit board.
DonUt try to
use a soldering gun, they are too hot.
(2) Use a small pointed tip and keep it clean.
Keep a damp piece
of sponge by the iron and wipe the tip on it after each use.
(3) Use 60-40 rosin-core solder ONLY.
der or externally applied fluxes.
solder you can get.
DO NOT use acid-core sol-
Use the smallest diameter
NOTE:
DO NOT press the top of the iron on the pad or
trace.
This will cause the trace to "lift" off
of the board which will result in permanent damage.
(4) In soldering, wipe the tip, apply a light coating of new
solder to it, and apply the tip to both parts of the joint,
that is, both the component lead and the printed-circuit pad.
Apply the solder against the lead and pad being heated, but
not directly to the tip of the iron.
Thus, when the solder
AIV-l
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