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PROCESSOR TECHNOLOGY CORPORATION
CUTS, COMPUTER USERS TAPE SYSTEM
SECTION II
2.3
ASSEMBLY PRECAUTIONS
2.3.1
Handling MOS Integrated Circuits
Many of the IC's used in the CUTS are MOS devices.
They can
be damaged by static electricity discharge.
Always handle MOS IC's
so that
gQ
discharge will flow through the IC.
Also, avoid unneces-
sary handling and wear cotton--rather than
synthetic-~clothing
when
handling these IC's.
2.3.2
Soldering **IMPORTANT**
1.
Use a fine tip, low-wattage iron, 25 watts maximum.
2.
DO NOT use excessive amounts of solder.
DO solder neat-
ly and as quickly as possible.
3.
Use only 60-40 rosin-core solder.
NEVER use acid-core
solder or externally applied fluxes.
4.
To prevent solder bridges, position iron tip so that it
does not touch adjacent pins and/or traces simultaneously.
5.
DO NOT press tip of iron on pad or trace.
To do so can
cause the pad or trace to "lift" off the board and permanently
damage it.
6.
The
flow through to
solder bridges.
component.
CUTS circuit board has plated-through holes.
Solder
the component (front) side of the board can produce
Check for such bridges after you install each
7.
The CUTS circuit board has an integral solder mask (a
lacquer coating) that shields selected areas on the board.
This
mask minimizes the chances of creating solder bridges during assem-
bly.
DO, however, check all solder joints for possible bridges.
8.
Additional pointers on soldering are provided in Appen-
dix III of this manual.
2.3.3
Installing and Removing CUTS Module
NEVER install the CUTS in, or remove it from the computer
with the power on.
To do so can damage the module.
2.3.4
Installing and Removing Integrated Circuits.
NEVER install or remove integrated circuits while power is
applied to the CUTS.
To do so can damage the IC.
11-6
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