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PROCESSOR TECHNOLOGY CORPORATION
CUTS, COMPUTER USERS TAPE SYSTEM
SECTION II
Step 13 continued.
To install an Augat pin, insert it into the mounting hole
from the component (front) side of board and solder the pin
from the solder (back) side of the board so the solder
"wicks up" to the front side.
(This will hold the pin firm-
ly in place.)
Then insert a component lead into the pin and reheat the
solder.
Using the component lead, adjust pin until it is
perpendicular to board.
Allow solder to cool while holding
the pin as steady as possible.
If the cooled solder is mottled or
crystallized, a "cold joint" is indi-
cated, and the solder should be reheated.
Step 14.
switch so
tion, the
the first
Install DIP switch in location Sl.
Switch No. 1 is at the left.
(With
ON position of each switch is
~.)
seven switches are active.
position
this orienta-
Note that only
(~step
15.
Install DIP reed relays in locations Kl and K2.
Be sure to position each relay with its end notch at the top
(pin 1 in upper left corner).
These relays are soldered to
Ihe board.
(Refer to "Loading DIP Devices" in Appendix IV.)
(0{
Step 16.
Install U6 (1458 or 5558) in its location.
Posi-
U6 with its end notch at the top (pin 1 in upper left
corner) and solder to board.
(Refer to "Loading DIP Devices"
in Appendix IV.)
(~step
17.
Install U5 (78L12) in its location just above U6.
position u5 with its flat side at the bottom, insert leads
and push straight down until it is 3/16" above the surface
of the board.
Solder and trim leads.
~~tep
18.
Install DIP sockets.
Install each socket in the
indicated location with its end notch oriented as shown on
the circuit board and assembly drawing.
Take care-not to-
create solder bridges between the pins and/or traces.
INSTALLATION TIP
Insert socket pins into mounting pads of
appropriate location.
On back (solder)
side of board, bend pins at opposite cor-
ners of socket (e.g. pins 1 and 9 on a
Continued on Page 11-14.
11-13
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