Digi ConnectCore 6UL Hardware Reference Manual page 125

Assembly instructions
Two thermocouple locations are recommended to achieve proper attachment of SoM:
For castellation applications, one thermocouple located on a castellation (preferable a power
n
or ground castellation) and a second located near the underside center of the SOM to ensure
SOM is not exposed to excessive temperatures.
For LGA applications, one thermocouple located on the outer-most row (preferable a power or
n
ground pad) and a second located near the underside center of the SOM to ensure SOM is not
exposed to excessive temperatures.
Note Digi recommends X-ray analysis after reflow to confirm proper mounting and solder reflow.
The ConnectCore 6UL module is approved to withstand a total of four (4) reflow cycles. Two (2) reflow
cycles are required for manufacturing the ConnectCore 6UL module. Two (2) reflow cycles are
remaining for mounting the module on the carrier board. Digi strongly recommends soldering the
ConnectCore 6UL module during the last reflow cycles of the carrier board manufacturing process.
ConnectCore® 6UL Hardware Reference Manual
Reflow oven profile
125