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ConnectCore 6 Plus Hardware Reference Manual...
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Information in this document is subject to change without notice and does not represent a commitment on the part of Digi International. Digi provides this document “as is,” without warranty of any kind, expressed or implied, including, but not limited to, the implied warranties of fitness or merchantability for a particular purpose.
Supported devices MCA pinout Shared I2C bus Shared SPI bus CryptoAuthentication device Module pinout Signal usage limitations Specifications for the ConnectCore 6 Plus Electrical characteristics Voltage supplies Power consumption Power consumption use cases Global power consumption Mechanical specifications Host PCB footprint...
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Maximum power and frequency specifications Labeling requirements Transmitters with detachable antennas Europe ETSI Maximum power and frequency specifications (Europe ETSI) OEM labeling requirements CE labeling requirements Declarations of Conformity Approved antennas Bluetooth SIG-qualified hardware and firmware ConnectCore 6 Plus Hardware Reference Manual...
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The ConnectCore 6 Plus is an ultra-compact and highly integrated system-on-module solution based on the NXP i.MX6QP Cortex-A9 processor family. With processor speed up to 1.0 GHz, the ConnectCore 6 Plus offers a truly future-proof platform solution with scalable performance and pre-certified dual-band Wi-Fi (802.11a/b/g/n/ac) with Bluetooth 4.2 dual mode connectivity.
Features and functionality The ConnectCore 6 Plus module is based on the i.MX6QP processor from NXP. This processor offers a high number of interfaces. Most of these interfaces are multiplexed and are not available simultaneously. The module has the following features: i.MX6QP ARM Cortex-A9 cores operating at speed up to 1.0 GHz...
Power supply architecture Power supply architecture The ConnectCore 6 Plus provides a primary 5 V power supply input. This supply is the main power domain to the on-module Dialog DA9063 power management IC (PMIC), which generates all required supply voltages for the module components as well as the carrier board.
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150 mV 1 µA 1 µA VDD_ LDO9 0.95 - +/-1% 3.3 V 200 mA 150 mV 3.6 V 1 µA VDD_ LDO10 0.9 - 3.6 +/-3% 3.3 V 300 mA 150 mV WLAN_ ConnectCore 6 Plus Hardware Reference Manual...
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NVCC_SD3 VGEN_3V3 PCIE_VPH 2.5V (VDDHIGH_CAP_2V5) The remaining I/O voltages must be set externally and are left open on the ConnectCore 6 Plus module. See the following table for operating ranges of the remaining I/O supplies. Power domain NVCC_ENET 1.65 V 3.6 V...
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3.3 V—and LDO2/3/4/6/8 options—are dedicated power sources for supplying i.MX6QP power domains. The MCU - assist specific power domain (VLDO3_MCA) available on the ConnectCore 6 Plus LGA pads is a power supply output powering the on-module Kinetis processor. ConnectCore 6 Plus Hardware Reference Manual...
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About the ConnectCore 6 Plus Power supply architecture The following diagram outlines the power supply approach of the ConnectCore 6 Plus. Inputs are marked red, blue marks are outputs. ConnectCore 6 Plus Hardware Reference Manual...
Bootstrap Bootstrap The ConnectCore 6 Plus module can be configured to boot from different devices and interfaces determined by the Boot ROM. The configuration of the CPU booting process is done through: BOOT_MODE register, which selects the boot mode of the processor eFUSEs and/or GPIOs, which determine the boot configuration Four boot modes are available on the i.MX6QP processor.
However, this time the values of some registers are overridden using multiple GPIOs—which are latched during power-up. The following configuration is done internally in the ConnectCore 6 Plus module in order to enable booting from the internal eMMC memory:...
Wireless interfaces WLAN IEEE 802.11a/b/g/n/ac The 2.4 GHz band on the ConnectCore 6 Plus module supports 20/40 MHz bandwidths, and the 5 GHz band supports 20/40/80 MHz bandwidths. The following sections specify the performance of the WLAN IEEE 802.11a/b/g/n/ac interface on the ConnectCore 6 Plus module.
Note DFS = Dynamic Frequency Selection TPC = Transmit Power Control SRD = Short Range Devices 25 mW max power Receive sensitivity The following table lists typical receive sensitivity values for the ConnectCore 6 Plus module. Mode 802.11b 802.11ga 802.11n 802.11ac...
MCA hardware Supported devices The ConnectCore 6 Plus module is designed to support a Kinetis processor in a QFN48 package. See below for a list of compatible Kinetis processors that can be used in this package size: MKL14Z32VFT4...
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About the ConnectCore 6 Plus MCA hardware MKL24Z64VFT4 MKL25Z128VFT4 MKL25Z32VFT4 MKL25Z64VFT4 MKL26Z128VFT4 MKL26Z64VFT4 MKL26Z32VFT4 K10P48M50SF0 K20P48M50SF0 By default, NXP MKL14Z32VFT4 is populated on the module variants supporting the MCA unit. ConnectCore 6 Plus Hardware Reference Manual...
MCA hardware MCA pinout The table below contains the pinouts for the MCA unit on ConnectCore 6 Plus module. The pinout information assumes the use of NXP MKL14Z32VFT4 microcontroller. Using a different Kinetis microcontroller may change the functions available on the MCA pins.
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VDDA LDO3_MCA MCA power supply A 100 nF capacitor connected to GND is placed close to this pin on ConnectCore 6 Plus SOM. VREFH AC10 MCA_VREFH Not used on module. A 100 nF capacitor connected to GND is placed close to this pin on ConnectCore 6 Plus SOM.
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Not used on module. PTE25 For K10 and K20 processors, this pin is VBAT. ConnectCore 6 Plus SOM has a 0R resistor foreseen on TPM0_CH1 this pin for connecting this signal to LDO3_MCA. By default, the resistor is not populated and MCA_IO28 is I2C0_SDA available on module pad.
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TPM0_CH1 NMI_b LDO3_MCA MCA power supply 1x 100 nF + 1x1 µF capacitors connected to GND are placed close to this pin on ConnectCore 6 Plus SOM. MCA ground EXTAL0 PMIC_STBY_ Connected on ConnectCore 6 Plus SOM to i.MX6QP PTA18 processor signal PMIC_STBY_REQ (ball F11) and PMIC signal SYS_EN/GPIO8 (ball B9).
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I2C2_SCL/KEY_COL3 signal (ball I2C0_SCL U5) over N-channel MOSFET. TPM2_CH0 ADC0_SE13 INTERNAL_ Connected directly to PMIC I2C_SDA signal and to PTB3 I2C_SDA i.MX6QP processor I2C2_SDA/KEY_ROW3 signal (ball I2C0_SDA T7) over N-channel MOSFET. TPM2_CH1 ConnectCore 6 Plus Hardware Reference Manual...
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This MCA pin is connected to 32K output of the PMIC. PTC1/LLWU_ For KL14, KL15, KL24 and KL25 this pin can be P6/RTC_ configured as RTC_CLKIN signal. CLKIN I2C1_SCL TPM0_CH0 ADC0_SE11 MCA_IO9 Not used on module. PTC2 I2C1_SDA TPM0_CH1 ConnectCore 6 Plus Hardware Reference Manual...
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Not used on module. PTC4/LLWU_ SPI0_PCS0 UART1_TX TPM0_CH3 MCA_IO12 Not used on module. PTC5/LLWU_ SPI0_SCK LPTMR0_ ALT2 CMP0_OUT CMP0_IN0 MCA_IO13 Not used on module. PTC6/LLWU_ SPI0_MOSI EXTRG_IN SPI0_MISO CMP0_IN1 MCA_IO19 Not used on module. PTC7 SPI0_MISO SPI0_MOSI ConnectCore 6 Plus Hardware Reference Manual...
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(ball N5) and to LGA pad D5. SPI0_MISO This pin can be configured as a SPI MOSI shared MOSI UART2_TX between MCA and i.MX6QP processor. TPM0_CH3 SPI0_MOSI MCA_IO16 Not used on module. PTD4/LLWU_ SPI1_PCS0 UART2_RX TPM0_CH4 ConnectCore 6 Plus Hardware Reference Manual...
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UART0_TX SPI1_MOSI The i.MX6QP pads listed above are connected to ConnectCore 6 Plus pads. If the MCA microcontroller firmware doesn’t use these signals, they are available on the carrier board and can be used in any of the alternative functions listed above.
MCA hardware Shared I2C bus The screenshot below shows how the I2C bus (I2C2) is used on ConnectCore 6 Plus module. The bus is shared between i.MX6QP processor and the PMIC, the MCA, and the cryptochip. The usage of N- channel MOSFET ensures the bus is fully isolated and allows the i.MX6QP processor to be shut off...
In addition to an I2C interface, i.MX6QP shares an SPI bus with the MCA microcontroller. The table below shows this connection: SPI function i.MX6QP pad MCA I/O SPI Chip Select CSI0_DAT11 (ConnectCore 6 Plus LGA pad PTD0 (MCA pin 41):| A6): Alt0: - Alt0: IPU1_CSI0_DATA11...
About the ConnectCore 6 Plus CryptoAuthentication device CryptoAuthentication device The ConnectCore 6 Plus includes an Atmel CryptoAuthentication Device. This is a highly secure cryptographic co-processor with secure hardware-based key storage. It includes the following features: Performs high-speed public key (PKI) algorithms (ECDSA and ECDH).
The module has a LGA pad structure based on 400 pads. See the following diagram for the general layout, which shows the top view of the module pinouts. The following table provides the pinout of the ConnectCore 6 Plus module. Additional timing and electrical information can be found in either NXP i.MX6QP processor datasheet (www.nxp.com) or in Dialog DA9063 product datasheet (www.dialog-semiconductor.com).
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CPU (only the CPU). Output: line asserted during reset. Can be used to synchronize external circuitry reset. SATA_TX_P SATA_VPH VGEN_3V3 VGEN_3V3 VGEN_3V3 ALT0: SD3_DATA6 SD3_DAT6 VGEN_3V3 ALT1: UART1_RX_DATA ALT2: ALT3: ALT4: ALT5: GPIO6_IO18 ALT6: ALT7: ConnectCore 6 Plus Hardware Reference Manual...
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ALT7: - the MCA. ALT0: SD1_DATA0 NVCC_SD1 SD1_DAT0 Signal only ALT1: ECSPI5_MISO (VGEN_3V3) available ALT2: externally in non- ALT3: GPT_CAPTURE1 wireless variants ALT4: of the SOM. ALT5: GPIO1_IO16 ALT6: ALT7: LVDS1_TX2_N NVCC_LVDS_2P5 ConnectCore 6 Plus Hardware Reference Manual...
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ALT4: I2C0_SCL ALT5: SPI0_MOSI ALT6: - ALT7: - ALT0: - MCA_IO8 LDO3_MCA Signal only ALT1: PTB17 available in ALT2: SPI1_MISO variants carrying ALT3: UART0_TX the MCA. ALT4: TPM_CLKIN1 ALT5: SPI1_MOSI ALT6: - ALT7: - ConnectCore 6 Plus Hardware Reference Manual...
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LVDS0_TX3_N NVCC_LVDS_2P5 NVCC_RGMII ALT0: CMP0_IN1 Assuming NXP MCA_IO19 LDO3_MCA ALT1: PTC7 MKL14Z32VFT4 is ALT2: SPI0_MISO populated. ALT3: - ALT4: - Signal only ALT5: SPI0_MOSI available in ALT6: - variants carrying ALT7: - the MCA. ConnectCore 6 Plus Hardware Reference Manual...
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LDO3_MCA. By default, the resistor is not populated and MCA_IO28 is available on module pad. 1x 100nF + 1x1µF capacitors connected to GND are placed close to this pin on ConnectCore 6 Plus SOM. ConnectCore 6 Plus Hardware Reference Manual...
Signal usage limitations The following signals available on ConnectCore 6 Plus pads have a limited usage: SD1_CLK (pad L21), SD1_CMD (pad J23), SD1_DAT[3:0] (pads L20, J21, J22 and N24) are used internally by the wireless, so they can't be used externally.
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About the ConnectCore 6 Plus Signal usage limitations ON/OFF (pad D18) signal is connected to PMIC and MCA. #POR (pad E18) is connected to PMIC and i.MX6QP processor. ConnectCore 6 Plus Hardware Reference Manual...
Specifications for the ConnectCore 6 Plus Electrical characteristics Power consumption Mechanical specifications Environmental specifications ConnectCore 6 Plus Hardware Reference Manual...
Any required ESD protection must be implemented on the carrier board. Power consumption This section contains data on the power consumption of the ConnectCore 6 and ConnectCore 6 Plus system-on-module. The power is measured at the input of the SOM, i.e. VSYS input power rail. The power architecture of the SOM requires some of the PMIC regulators to be externally powered.
Specifications for the ConnectCore 6 Plus Mechanical specifications Global power consumption The following table list the global power consumption of the ConnectCore 6 and ConnectCore 6 Plus system-on-module when the system is under the use cases described above: Digi Embedded Yocto 2.4...
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Specifications for the ConnectCore 6 Plus Mechanical specifications ConnectCore 6 Plus module weight is 27 grams. There must be a recess in the host PCB to accommodate the components on the bottom side of the SOM. All dimensions are in millimeters.
Specifications for the ConnectCore 6 Plus Environmental specifications Host PCB footprint Note Minimum thickness of the host board shall be 2 mm. Environmental specifications The i.MX6QP thermal specification is based on maximum junction temperature (Tj) of the specific application processor variant used. In order to support thermal management assistance through software, the i.MX6QP processor has a built-in junction temperature sensor/monitor.
Depending on the operating system, the junction temperature is displayed in milli °C or °C. The ConnectCore 6 Plus multichip module was designed to provide customers with unique options to simplify and support the implementation of thermal management approaches in their designs, as...
Moisture sensitivity and shelf life Moisture sensitivity and shelf life The ConnectCore 6 Plus module is classified as a Level 3 Moisture Sensitive Device in accordance with IPC/JEDEC J-STD-020. 1. Calculated shelf life in sealed packaging: 12 months at <40° C and <90% relative humidity (RH).
It is important that the carrier board is also coplanar. If the carrier board is thinner than the ConnectCore 6 Plus it is recommended that the assembly be supported during the reflow process, i.e. reflow fixture should be used to minimize the potential bow of the carrier card.
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(reflow or vapor phase) and carrier board design. The ConnectCore 6 Plus i.MX6QP is approved to withstand a total of four reflow cycles. Two reflow cycles are required for manufacturing the ConnectCore 6 Plus i.MX6QP SOM. Two (2) reflow cycles are remaining for mounting the module on the carrier board.
Regulatory information and certifications United States FCC Canada (ISED) Europe ETSI Bluetooth SIG-qualified hardware and firmware ConnectCore 6 Plus Hardware Reference Manual...
The system integrator must ensure that the text on top side of the module is placed on the outside of the final product. ConnectCore 6 Plus module may only be used with antennas approved [refer to the antenna tables in this section].
Maximum power and frequency specifications (FCC) Maximum transmit Peak power at antenna antenna band gain Technology connector Frequencies 2.4 GHz 2.5 dBi BT + EDR 8.8 mW [BW 1 MHz] x 79 non-overlapping channels, # (center freq. MHz): * [2400 - 2483.5 MHz]: 0 (2402) to 78 (+9.5 dBm) (2480) Bluetooth...
FCC Section 15.203 (Unique Antenna Connectors) and Section 15.247 (Emissions). A concrete antenna, detailed in the table below, has been used to certify the ConnectCore 6 Plus wireless module. This antenna can be replaced by others, however further certification testing is required.
Digi International Inc. has not approved any changes or modifications to this device by the user. Any changes or modifications could void the user’s authority to operate the equipment.
L’émetteur ne doit pas être colocalisé ni fonctionner conjointement avec à autre antenneou autre émetteur. Europe ETSI The ConnectCore 6 Plus module has been certified for use in several European countries. For a complete list, refer to www.digi.com. If the ConnectCore 6 Plus module is incorporated into a product, the manufacturer must ensure compliance of the final product with articles 3.1a and 3.1b of the RE Directive (Radio Equipment...
Maximum power and frequency specifications (Europe ETSI) Maximum transmit Peak power at antenna antenna band gain Technology connector Frequencies 2.4 GHz 2.5 dBi BT + EDR 4.9 mW (+6.9 [BW 1 MHz] x 79 non-overlapping channels, # (center freq. MHz): * [2400 - 2483.5 MHz]: 0 (2402) to dBm) 78 (2480) Bluetooth...
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Maximum transmit Peak power at antenna antenna band gain Technology connector Frequencies WLAN 55.8 mW (+17.5 [BW 20 MHz] x 13 overlapping channels, # (center freq. MHz): * [2400 - 2483.5 MHz]: 1 (2412), 2 dBm) (2417), 3 (2422), 4 (2427), 5 (2432), 6 (2437), 7 (2442),8 (2447), 9 (2452), 10 (2457), 11 (2462), 12 (2467), 13 (2472) [BW 40 MHz] x 9 overlapping channels, # (center freq.
ConnectCore 6 Plusmodule. Bluetooth SIG-qualified hardware and firmware The ConnectCore 6 Plus is qualified by the Bluetooth SIG. At the hardware level, the ConnectCore 6 Plus is listed as a Controller Subsystem under the following identifiers: QD ID # 101838...
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You can combine these hardware and firmware elements into a new end product that is Bluetooth Sig-qualified with no additional Bluetooth testing, as long as you do not introduce any modifications to the Bluetooth design. ConnectCore 6 Plus Hardware Reference Manual...