Package; Package Selection; Table 3. Package Summary - ST STM32F4 Series Application Note

Package

4 Package
4.1

Package Selection

Package should be selected by taking into account the constrains that are strongly
dependent upon the application.
The list below summarizes the more frequent ones:
–
–
–
–
–
–
Table 3 summarizes the available packages for all STM32F4xxxx family.
(1)
Size (mm)
Sales numbers
STM32F401xB/C
STM32F401xD/E
STM32F405xx/407xx X
STM32F410xx
STM32F411xx
STM32F412xx
STM32F413xx/423xx X
STM32F415xx/417xx X
STM32F427xx/429xx
20/50
Amount of interfaces required.
Some interfaces might not be available on some packages.
Some interfaces combinations could not be possible on some packages.
PCB technology constrains.
Small pitch and high ball density could require more PCB layers and higher class
PCB
Package height
PCB available area
Noise emission or signal integrity of high speed interfaces.
Smaller packages usually provide better signal integrity. This is further enhanced
as Small pitch and high ball density requires multilayer PCBs which allow better
supply/ground distribution.
Compatibility with other devices.

Table 3. Package summary

X X
X X X
X
X X
X X X
X X
X X X
X X X X X
X X
X
X
X X
X X X
X X X
X
X X
AN4488 Rev 7
X
X
X
X
X
AN4488
X
X
X