Summary
6
Summary
This document presents an introduction to designing a 4-layer PCB board for the CC3100/CC3200
SimpleLink Wi-Fi easy-to-layout QFN packaged family of devices. In addition to the recommendations
presented here, see the CC3100 SimpleLink Wi-Fi and IoT Solution BoosterPack design files located at
http://www.ti.com/lit/zip/swrc288
LaunchPad board design files located at http://www.ti.com/lit/zip/swrc289.
7
Additional References
1. CC31xx and CC32xx
2. The CC3100 SimpleLink™ Wi-Fi® and IoT Solution for MCU Applications data sheet (SWAS031)
3. The CC3200 SimpleLink™ Wi-Fi® and IoT Solution, a Single Chip Wireless MCU data sheet
(SWAS032)
20
CC3100 and CC3200 SimpleLink™ Wi-Fi
Layout Guidelines
and the CC3200 SimpleLink Wi-Fi and IoT Solution With MCU
main landing
page.
®
and Internet of Things Solution
Copyright © 2014–2018, Texas Instruments Incorporated
SWRU370B – June 2014 – Revised August 2018
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