Device Overview; Pcb Specification; Pcb Stack-Up; Example Stack-Up - Texas Instruments CC3100 SimpleLink Wi-Fi User Manual

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Device Overview

Start the design with the industry's first Internet-on-a-chip™. Created for the Internet of Things (IoT), the
SimpleLink Wi-Fi family has several variants. The CC3100 SimpleLink Wi-Fi and IoT solution dramatically
simplifies the implementation of Internet connectivity. This product integrates all protocols for Wi-Fi and
Internet, which greatly minimizes host microcontroller (MCU) software requirements. CC3200 device is a
wireless MCU that integrates a high-performance ARM
processor subsystem, allowing customers to develop an entire application with a single IC. With on-chip
Wi-Fi, Internet, and robust security protocols, no prior Wi-Fi experience is needed for faster development.
SimpleLink Wi-Fi is a complete platform solution, including various tools and software, sample
applications, user and programming guides, reference designs, and the TI E2E™ support community. The
devices are available in an easy to lay-out QFN package. The layout for both devices are similar, with a
higher number of IOs routed for the CC3200.
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PCB Specification

3.1

PCB Stack-Up

An example stack-up is shown in
user can alter the layer stack-up based on their requirements, but the impedance of the 50-Ω lines should
be recalculated. Having the L1-L2 distance reduced helps improve the grounding and the RF decoupling.
TI recommends keeping the L1-L2 distance similar to the recommended value.
Type
Mask
Copper
FR-4
Copper
FR-4
Copper
FR-4
Copper
Mask
Total thickness ~ 1.1mm (+/- 10%)
SWRU370B – June 2014 – Revised August 2018
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Figure 1, used for the construction of the CC3100BOOST Rev3.3-A. The
Figure 1. Example Stack-up
Layer
L1
L2
L3
L4
CC3100 and CC3200 SimpleLink™ Wi-Fi
Copyright © 2014–2018, Texas Instruments Incorporated
Cortex -M4 MCU with the CC3100 network
® ®
Height(um)
25
35
255
35
350
35
255
35
25
Total
1050
®
and Internet of Things Solution
Device Overview
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Layout Guidelines