Texas Instruments CC3100 SimpleLink Wi-Fi User Manual page 11

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4.2.4 Layer-4
Layer-4 is used for routing the power and the signal lines on the board (see
power dissipation GND layer for the QFN package. The bottom GND plane must be maximized for the
best thermal performance. The solder mask has been kept open below the QFN device to improve heat
dissipation and yield.
SWRU370B – June 2014 – Revised August 2018
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Figure 6. Layer-4
CC3100 and CC3200 SimpleLink™ Wi-Fi
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