ADLINK Technology COM Express Express-HLE User Manual page 22

3.3.11 SPI (BIOS only)
Signal Pin # Description
SPI_CS# B97 Chip select for Carrier Board SPI BIOS Flash.
SPI_MISO A92 Data in to module from carrier board SPI BIOS flash.
SPI_MOSI A95 Data out from module to carrier board SPI BIOS flash.
SPI_CLK A94 Clock from module to carrier board SPI BIOS flash.
SPI_POWER A91 Power supply for Carrier Board SPI – sourced from Module
– nominally 3.3V.
The Module shall provide a minimum of 100mA on
SPI_POWER.
Carriers shall use less than 100mA of SPI_POWER.
SPI_POWER shall only be used to power SPI devices on
the Carrier
BIOS_DIS0# A34 Selection strap to determine the BIOS boot device.
BIOS_DIS1# B88 Selection strap to determine the BIOS boot device.
3.3.12 Miscellaneous
Signal Pin #
SPKR B32
WDT B27
THRM# B35
THERMTRIP# A35
FAN_PWMOUT B101
FAN_TACHIN11 B102
TPM_PP11 C83
3.3.13 SMBus
Signal Pin # Description
SMB_CK B13 System Management Bus bidirectional clock line. Power
sourced through 5V standby rail and main power rails.
SMB_DAT# B14 System Management Bus bidirectional data line. Power
sourced through 5V standby rail and main power rails.
SMB_ALERT# B15 System Management Bus Alert – active low input can
be used to generate an SMI# (System Management
Interrupt) or to wake the system. Power sourced
through 5V standby rail and main power rails.
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Description
Output for audio enunciator, the "speaker" in PC-AT
systems
Output indicating that a watchdog time-out event has
occurred.
Input from off-module temp sensor indicating an over-temp
situation.
Active low output indicating that the CPU has entered
thermal shutdown.
Fan speed control. Uses the Pulse Width Modulation
(PWM) technique to control the fan's RPM.
Fan tachometer input for a fan with a two pulse output.
Trusted Platform Module (TPM) Physical Presence pin.
Active high. TPM chip has an internal pull down. This
signal is used to indicate Physical Presence to the TPM.
I/O PU/PD
O 3.3VSB
I 3.3VSB
O 3.3VSB
O 3.3VSB
O P 3.3VSB
I PU 10K 3.3V
I PU 10K 3.3V
I/O PU/PD
O 3.3V
O 3.3V
I 3.3V
O 3.3V PU 330 3.3V
O OD 3.3V
I OD 3.3V PU 10k 3.3V
I 3.3V
PD 10k 3.3V
I/O PU/PD
I/O OD 3.3VSB PU 2k2 3.3VSB
I/O OD 3.3VSB PU 2k2 3.3VSB
I 3.3VSB PU 10k 3.3VSB
Comment
Carrier shall pull to GND
or leave no- connect.
Carrier shall pull to GND
or leave no- connect
Comment
PD is only placed
when TPM is
installed on module
Comment
Express-HLE