Listing Of Memory Devices; Etx Module 86-611Xpcb Mc9S12Dg256 (U2) - Microsemi SyncServer S200 User Manual

Listing of Memory Devices

The following devices contain either volatile or non-volatile memory:
In This section
ETX Module
86-611xPCB
MC9S12DG256 (U2)
ETX Module
256MB SDRAM. The 256MB Synchronous Dynamic RAM is installed on the ETX Mod-
n
ule in a DIMM socket. This part is used as system RAM memory for the ETX Module's
x86 processor. The content in this device is volatile and is lost when the SyncServer is
powered down. This part is socketed (ETX).
BIOS. 512KB FLASH memory used on the ETX module for system BIOS. This part is
n
soldered to the ETX module. This part is not reprogrammed in normal operation. The con-
tent in this device is non-volatile and there is no procedure to clear this memory.
86-611xPCB
512MB Compact Flash Primary (J3). The 512MB Compact Flash device is installed on
n
the 86-610x PCB. This part is used as a virtual Hard Drive by the ETX Module's x86 pro-
cessor. There is no procedure to clear this memory. This part is socketed (J3).
U41 is a Xilinx XC2S200 FPGA that is re-programmed each time the board is powered
n
up. The program for this part is contained in J3's Compact Flash memory and is down-
loaded into U41 by U39. The content of this device is volatile and is lost when the board is
powered down. This part is soldered to the PCB.
M93C46 1Kb Serial Microwire EEPROM for Intel 82551ER Fast Ethernet Controller con-
n
figuration (U34). This non-volatile part is used at power-on to initialize registers in the
Intel Fast Ethernet Controller. This part is not reprogrammed in normal operation. This
part is a DIP that is mounted in an 8-pin socket.
M93C46 1Kb Serial Microwire EEPROM for system configuration (U40), controlled by
n
PCI9030. This non-volatile part is used to store unit specific data. This part is a DIP that is
mounted in an 8-pin socket.
997-01520-02 Rev. G2..........................................................................
ETX Module
145
145
146
Page 145