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The following illustration shows the components of the PHM.
Figure 95. PHM components
Heat sink
1
Heat sink triangular mark
2
Processor identification label
3
Nut and wire bail retainer
4
Torx T30 nut
5
Anti-tilt wire bail
6
Processor carrier
7
Clips to secure carrier to heat sink
8
Procedure
Step 1.
Make preparations for this task.
a.
Remove the top cover. See
b.
Remove both PCIe riser cages or fillers, the chassis air baffle, and the PCIe expansion tray (see
"Remove a 4U PCIe riser cage" on page
"Remove the 4U PCIe expansion tray" on page
c.
Remove the following components depending on the location of the processor that is to be
removed:
• If the processor is located on the processor and memory expansion tray, do not remove the
expansion tray.
ThinkSystem SR860 V2 Maintenance Manual
208
Clips to secure processor in carrier
9
Carrier triangular mark
10
Processor ejector handle
11
Processor heat spreader
12
Thermal grease
13
Processor contacts
14
Processor triangular mark
15
"Remove the top cover" on page
255,
"Remove the chassis air baffle" on page
249).
240.
270, and
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