Field Service Ver1.0 Feb.2006
DIPSW No. Bit
DipSW18
0
Separation of a defective part
from the tray 1 (upper stage of
the main body)
1
Separation of a defective part
from the tray 2 (lower stage of
the main body)
2
—
3
—
4
Separation of a defective part
from the tray 3 (PC-202 upper
stage/PC-402)
5
Separation of a defective part
from the tray 4 (PC-202 lower
stage)
6
Separation of a defective part
from the tray 5 (LU)
7
—
DipSW19
0
Separation of a defective part
from the printer controller (IC)
1
Separation of a defective part
from the FAX kit (FK)
2
—
3
Separation of a defective part
from HDD
4
—
5
—
6
—
7
Separation of a defective part
from DF
DipSW20
0
Separation of a defective part
from the network
1
Separation of a defective part
from IEEE1284
2
Separation of a defective part
from USB
3
—
4
—
5
Separation of a defective part
from SD
6
—
7
—
Function
Normal
Normal
Normal
Normal
Normal
Normal
Normal
Normal
Normal
Normal
Normal
Normal
Normal
0
1
Separated
Separated
—
—
—
—
Separated
Separated
Separated
—
—
Separated
Separated
—
—
Separated
—
—
—
—
—
—
Separated
Separated
Separated
Separated
—
—
—
—
Separated
—
—
—
—
10. SERVICE MODE
Default setting
Japan
Inch
Metric
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
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