Removing The Ethernet Expansion Module; Installing Optional Gbics - Enterasys Matrix E1 1G587-09 Installation Manual

Installing Optional GBICs

3.4.3

Removing the Ethernet Expansion Module

To remove the Ethernet expansion module, refer back to
CAUTION: The expansion modules are NOT hot-swappable. The 1G58x-09 must be
powered down before the expansion modules are installed or removed. Hot-swapping
the expansion modules while the 1G58x-09 is powered on could cause the device to
stop forwarding frames.
1. Unscrew the two captive screws
➆
front panel .
2. Pull the two levers
➄
connectors part way.
3. To remove the module
until loosened. Then pull the module out of the slot.
CAUTION: If the slot is not going to be populated by another Ethernet expansion
module, you must replace the slot coverplate to prevent EMI emissions.
This completes the removal procedure.
3.5 INSTALLING OPTIONAL GBICs
The optional Enterasys Networks GBICs (models GPIM-01, GPIM-08, and GPIM-09) are
hot-swappable and may be installed into the Ethernet expansion module whether or not the device
is powered up. In either case, use the following installation instructions to prevent damaging either
the GBIC or the host Ethernet expansion module.
There are two different physical styles of GBICs that can be installed into the device.
•
One style has the squeeze-latch side clips as shown in
the installation procedure.
•
The other style has the locking bar as shown in
installation procedure.
CAUTION: The GBIC, 1G-2GBIC, and 1G58x-09 are sensitive to static discharges.
Use an antistatic wrist strap and observe all static precautions during this procedure.
Failure to do so could result in damage to the GBIC, 1G-2GBIC, or 1G58x-09. Always
leave the GBIC in the antistatic bag in which it was shipped or an equivalent antistatic
container until ready to install it.
3-6 Hardware Installation
➅
fastening the Ethernet expansion module
➀
out to their maximum travel. This disengages the module rear
➁
completely from the slot
Figure 3-2 and proceed as follows:
➃
, move the module gently from side to side
Figure 3-3, view A.
Figure 3-3, view B.
➁
to the device
Section 3.5.1 provides
Section 3.5.2 provides the