Repair - Parker H Series Installation & Service Instructions Manual

Safety Guidelines for the Application, Installation and Maintenance of Solid State Control
5.2 Preventive Maintenance (continued)
7. Enclosures should be inspected for evidence of
deterioration. Accumulated dust and dirt should be
removed from the top of the enclosures before opening
doors or removing covers.
8. Certain hazardous materials removed as part of
maintenance or repair procedure (e.g., polychlorinated
biphenyls (PCB) found in some liquid filled capacitors)
must be disposed of as described in Federal regulations.

5.3 Repair

If equipment condition indicates repair or replacement, the
manufacturer's instruction manual should be followed
carefully. Diagnostic information within such a manual should
be used to identify the probable source of the problem, and
to formulate a repair plan. The level of field repair
recommended by the manufacturer should be followed.
When solid state equipment is repaired, it is important
that any replacement part be in accordance with the
recommendations of the equipment manufacturer. Care
should be taken to avoid the use of parts which are no
longer compatible with other changes in the equipment.
Also, replacement parts should be inspected for
deterioration due to "shelf life" and for signs of rework or
wear which may involve factors critical to safety.
After repair, proper start-up procedures should be followed.
Special precautions should be taken to protect personnel
from hazards during start-up.
5.4 Safety Recommendations for
Maintenance Personnel
All maintenance work should be done by qualified
personnel familiar with the construction, operation, and
hazards involved with the equipment. The appropriate
work practices of NFPA 70E should be followed.
C.5.3 Repair
Follow manufacturer's instructions exactly when replacing
power semiconductors mounted on heatsinks since
improper installation may become the source of further
difficulties. Torque semiconductors or bolts retaining
semiconductors to the value specified using a torque
wrench. Too much pressure against a heatsink can
damage a semiconductor while too little can restrict the
amount of heat transferred from the semiconductor to the
heatsink and result in operation at higher temperature
with decreased reliability.
Exercise care when removing modules from a system
during maintenance.
returned to the manufacturer for repair. Any physical
damage sustained during removal may result in more
expensive repair or render the module unrepairable if
damage is too great.
Modules with electrostatic sensitive components should
be handled by the edges without touching components or
printed circuit conductors.
supplied with the replacement module when shipping the
module to the manufacturer for repair.
When the scope of repairs exceeds the manufacturer's
recommendations for field repair, the module(s) should
be returned to the manufacturer for repair. Doing so will
help to ensure that only properly selected components
are used, and that all necessary hardware and firmware
revisions are incorporated into the repair. Failure to make
necessary updates may result in safety, compatibility or
performance problems which may not become apparent
for some time after the repaired module has been placed
back in service. When firmware is protected by copyright
law, updates can be provided legally only by the
manufacturer or licensee.
Also see section 4.3.
20
Failed modules are frequently
Use packaging material
E116P