Package - Epson S1C17M20 Technical Manual

23 Package

SQFN4-24 package (S1C17M20/M23)
Top View
Bottom View
0.35
* The potential of the EXPOSED DIE PAD is the same as that of the substrate potential (V
S1C17M20/M21/M22/M23/M24/M25
TECHNICAL MANUAL (Rev. 1.0)
3.9
min
INDEX
2.4
min
7
6
C0.3
1
24
/0.45
min max
Figure 23.1 SQFN4-24 Package Dimensions
Seiko Epson Corporation
/4.1
max
/2.6
max
12
13
18
19
EXPOSED DIE PAD
0.5
23 PACKAGE
(Unit: mm)
) on the back of the IC.
SS
23-1