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EP-BX6
The entire enclosed product is called the Pentium
The packaging technology and each of the physical elements of the product are
referred to using accurate technical descriptions. This allows clear reference to
the products as just a processor. This is the model used in past packaging tech-
nologies like PGA, TCP, PQFP, DIP, etc.
S.E.C. Cartridge Terminology
®
•
Pentium
II or Pentium
The new enclosed card packaging technology is called a "Single Edge
Contact cartridge." This is similar to previous names for packaging
technology such as PGA or TCP.
•
Processor card
The green PCB (with or without components on it)
•
Processor core
The silicon on the PLGA package on the PCB
•
Cover
The plastic cover on the opposite side from the thermal plate.
•
Slot 1
The slot that the S.E.C. cartridge plugs into, just as the Pentium
processor uses Socket 8.
•
Retention mechanism
Formerly 'retention module' the dual posts, etc. that holds the cartridge in
place.
•
Thermal plate
The heatsink attach-
ment plate.
•
Heat sink supports
The support pieces that
are mounted on the
mainboard to provide
added support for
heatsinks.
®
®
III Processor
®
Pentium
II Processor
in an S.E.C.C. Package
Figure 1: Pentium
with S.E.C.C. or S.E.C.C.2 Package
Introduction
®
II or Pentium
III Processor.
®
Pentium
®
III Processor
in an S.E.C.C.2 Package
®
II/III Processor CPU
Pro
Page 1-3
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