Cartridge Terminology - EPOX EP-61BXC-A User Manual

EP-61BXC-A
packaging technology and each of the physical elements of the product are referred
to using accurate technical descriptions. This allows clear reference to the products
as just a processor. This is the model used in past packaging technologies like PGA,
TCP, PQFP, DIP, etc.
S.E.C. Cartridge Terminology
• Pentium
The new enclosed card packaging technology is called a "Single Edge
Contact cartridge." This is similar to previous names for packaging
technology such as PGA or TCP.
• Processor card
The green PCB (with or without components on it)
• Processor core
The silicon on the PLGA package on the PCB
• Cover
The plastic cover on the opposite side from the thermal plate.
• Slot 1
The slot that the S.E.C. cartridge plugs into, just as the Pentium
processor uses Socket 8.
• Retention mechanism
Formerly 'retention module' the dual posts, etc. that holds the cartridge
in place.
• Thermal plate
The heatsink attachment plate.
• Heat sink supports
The support pieces that are
mounted on the mainboard
to provide added support for
heatsinks.
The L2 cache (TagRAM, PBSRAM)
components keep standard industry
names.
®
The Pentium II or Deschutes Processor
is the first product to utilize the S.E.C.
cartridge technology and Slot 1
connector. Unless otherwise noted, any
references to "Pentium
®
II or Deschutes Processor
®
II Processor,"
Cover
Printed Circuit Board
®
Figure 1: Pentium
Processor CPU with S.E.C. Cartridge
Introduction
®
Pro
Thermal Plate
Processor
II or Deschutes
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