Table Of Contents - Intel SL8J6 - Pentium 4 Processor Datasheet

Contents
1 Introduction
1.1
1.2
2 Electrical Specifications
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
2.10
2.11
3 Package Mechanical Specifications
3.1
4 Pin List and Signal Description
4.1
4.2
5 Thermal Specifications and Design Considerations
5.1
5.2
Datasheet
.................................................................................................................. 9
Terminology......................................................................................................... 10
1.1.1 Processor Packaging Terminology......................................................... 10
References .......................................................................................................... 11
Power and Ground Pins ...................................................................................... 13
Decoupling Guidelines ........................................................................................ 13
2.2.1 V Decoupling ...................................................................................... 13
CC
2.2.2 FSB GTL+ Decoupling ........................................................................... 13
2.2.3 FSB Clock (BCLK[1:0]) and Processor Clocking.................................... 14
Voltage Identification ........................................................................................... 14
2.3.1 Phase Lock Loop (PLL) Power and Filter............................................... 16
Reserved, Unused, and TESTHI Pins.................................................................17
FSB Signal Groups..............................................................................................18
Asynchronous GTL+ Signals............................................................................... 19
Test Access Port (TAP) Connection.................................................................... 19
FSB Frequency Select Signals (BSEL[1:0]) ........................................................ 20
Absolute Maximum and Minimum Ratings .......................................................... 21
Processor DC Specifications............................................................................... 21
V Overshoot Specification............................................................................... 29
CC
2.11.1 Die Voltage Validation ............................................................................ 30
Package Mechanical Specifications .................................................................... 31
3.1.1 Package Mechanical Drawing ................................................................ 32
3.1.2 Processor Component Keep-out Zones ................................................. 35
3.1.3 Package Loading Specifications ............................................................ 35
3.1.4 Package Handling Guidelines ................................................................ 35
3.1.5 Package Insertion Specifications ........................................................... 36
3.1.6 Processor Mass Specification ................................................................ 36
3.1.7 Processor Materials................................................................................ 36
3.1.8 Processor Markings................................................................................ 36
3.1.9 Processor Pinout Coordinates................................................................ 37
Processor Pin Assignments ................................................................................ 39
Alphabetical Signals Reference .......................................................................... 54
Processor Thermal Specifications....................................................................... 63
5.1.1 Thermal Specifications ........................................................................... 63
5.1.2 Thermal Metrology ................................................................................. 66
Processor Thermal Features............................................................................... 67
5.2.1 Thermal Monitor ..................................................................................... 67
........................................................................................ 13
.................................................................31
.......................................................................... 39
................................. 63
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