Contents
Introduction ................................................................................................ 9
1
1.1
Terminology ....................................................................................................... 9
1.1.1
1.2
References ....................................................................................................... 11
2
2.1
2.2
Decoupling Guidelines ........................................................................................ 13
2.2.1
VCC Decoupling ..................................................................................... 13
2.2.2
VTT Decoupling ...................................................................................... 13
2.2.3
FSB Decoupling...................................................................................... 14
2.3
Voltage Identification ......................................................................................... 14
2.4
2.5
2.6
2.6.1
2.6.2
2.6.3
VCC Overshoot ...................................................................................... 20
2.6.4
2.7
2.7.1
FSB Signal Groups.................................................................................. 22
2.7.2
2.7.3
2.7.3.1
2.7.3.2
2.8
Clock Specifications ........................................................................................... 27
2.8.1
2.8.2
2.8.3
2.8.4
3
3.1
3.2
3.3
3.4
3.5
3.6
3.7
Processor Materials............................................................................................ 38
3.8
Processor Markings............................................................................................ 38
3.9
4
4.1
4.2
5
5.1
5.1.1
5.1.2
Thermal Metrology ................................................................................. 78
5.2
Datasheet
Specifications ........................................................................... 25
3