3.2.1 Single/Double Enclosures ................................................................................................................................. 3-3
.................................................................................................................................................... 3-4
3.3.1 16AIe and 8ROe ................................................................................................................................................. 3-4
3.3.3 ESR8 (Discontinued) .......................................................................................................................................... 3-5
3.3.4 MultiFlex ESR .................................................................................................................................................... 3-5
3.3.5 TD3..................................................................................................................................................................... 3-5
3.4.1.1 The Internal Modem ................................................................................................................................................ 3-6
3.5.1 Pressure Transducers......................................................................................................................................... 3-7
3.5.1.1 Mounting.................................................................................................................................................................. 3-7
3.5.2 Inside Temperature Sensor................................................................................................................................. 3-7
3.5.2.1 Location ................................................................................................................................................................... 3-7
3.5.2.2 Mounting.................................................................................................................................................................. 3-8
3.5.3 Outside Temperature Sensor.............................................................................................................................. 3-8
3.5.3.1 Location ................................................................................................................................................................... 3-8
3.5.3.2 Mounting.................................................................................................................................................................. 3-8
3.5.4.1 Location ................................................................................................................................................................... 3-8
3.5.4.2 Mounting.................................................................................................................................................................. 3-8
3.5.5 Supply and Return Air Sensors........................................................................................................................... 3-8
3.5.6.1 Location ................................................................................................................................................................... 3-9
3.5.7 Product Temperature Probes ............................................................................................................................. 3-9
3.5.8.1 Indoor RH Sensor .................................................................................................................................................... 3-9
3.5.8.2 Outdoor RH Sensors .............................................................................................................................................. 3-10
3.5.9 Dewpoint Probe................................................................................................................................................ 3-11
3.5.9.1 Location ................................................................................................................................................................. 3-11
3.5.9.2 Mounting................................................................................................................................................................ 3-11
3.5.10 Light Level Sensor.......................................................................................................................................... 3-11
3.5.10.1 Location ............................................................................................................................................................... 3-11
3.5.10.2 Mounting.............................................................................................................................................................. 3-11
3.5.11 Liquid Level Sensors ...................................................................................................................................... 3-11
4 E2 HARDWARE SETUP .......................................................................................................................................... 4-1
E2 ................................................................................................................................................... 4-1
4.1.1 Enclosure............................................................................................................................................................ 4-1
4.1.2 Main Processor Board ....................................................................................................................................... 4-1
4.1.4 Power Interface Board ....................................................................................................................................... 4-2
E2 ..................................................................................................................................................... 4-2
4.2.1 RS485 Ports........................................................................................................................................................ 4-2
4.2.2 RS485 Jumpers................................................................................................................................................... 4-2
4.2.3 Echelon Network Connect.................................................................................................................................. 4-2
vi • Table of Contents
.................................................................................................................................... 3-7
) ........................................... 3-5
026-1610 Rev 12 25-APR-2011