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Electrical Specifications
device storage conditions for a sustained period of time. At conditions outside sustained
limits, but within absolute maximum and minimum ratings, quality and reliability may
be affected.
Table 7-39.Storage Condition Ratings
Symbol
T
The non-operating device storage temperature.
absolute storage
Damage (latent or otherwise) may occur when
exceeded for any length of time.
T
The ambient storage temperature (in shipping
sustained storage
media) for a sustained period of time)
RH
The maximum device storage relative humidity
sustained storage
for a sustained period of time.
Time
A prolonged or extended period of time; typically
sustained storage
associated with customer shelf life.
NOTES:
1.
Refers to a component device that is not assembled in a board or socket and is not electrically connected to
a voltage reference or I/O signal.
2.
Specified temperatures are not to exceed values based on data collected. Exceptions for surface mount
reflow are specified by the applicable JEDEC standard. Non-adherence may affect processor reliability.
3.
T
applies to the unassembled component only and does not apply to the shipping media,
absolute storage
moisture barrier bags, or desiccant.
4.
Component product device storage temperature qualification methods may follow JESD22-A119 (low
temp) and JESD22-A103 (high temp) standards when applicable for volatile memory.
5.
Intel® branded products are specified and certified to meet the following temperature and humidity limits
that are given as an example only (Non-Operating Temperature Limit: -40°C to 70°C and Humidity: 50%
to 90%, non-condensing with a maximum wet bulb of 28°C.) Post board attach storage temperature limits
are not specified for non-Intel branded boards.
6.
The JEDEC J-JSTD-020 moisture level rating and associated handling practices apply to all moisture
sensitive devices removed from the moisture barrier bag.
7.
Nominal temperature and humidity conditions and durations are given and tested within the constraints
imposed by T
sustained storage
7.10
DC Specifications
The processor DC specifications in this section are defined at the processor
pins, unless noted otherwise. See
Chapter 6
The DC specifications for the DDR3 signals are listed in
and Test Access Port (TAP) are listed in
Table 7-40
specifications for junction temperature, clock frequency, and input voltages. Care
should be taken to read all notes associated with each parameter.
Datasheet
Parameter
and customer shelf life in applicable Intel boxes and bags.
for signal definitions.
lists the DC specifications for the processor and are valid only while meeting
Min
-25°C
-5°C
60% @ 24°C
0 Months
Chapter 8
for the processor pin listings and
Table 7-43
Table
7-44.
Max
Notes
125°C
1, 2, 3, 4
40°C
5, 6
6, 7
6 Months
7
Control Sideband
95
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