Solder Process; D.5.3 Solder Process; Figure 7-26. Positioning Solder On Ihs - Intel E2180 - Pentium Dual-Core 2.00GHz 800MHz 1MB Socket 775 CPU Design Manuallines

Case Temperature Reference Metrology

Figure 7-26. Positioning Solder on IHS

23. Measure the resistance from the thermocouple end wires again using the DMM
(refer to Section D.5.1.step 2) to ensure the bead is still properly contacting the
IHS.
D.5.3

Solder Process

24. Make sure the thermocouple that monitors the Solder Block temperature is
positioned on the Heater block. Connect the thermocouple to a handheld meter to
monitor the heater block temperature.
25. Verify the temperature of the Heater block station has reached 155 °C ±5 °C
before you proceed.
26. Connect the thermocouple for the device being soldered to a second hand held
meter to monitor IHS temperature during the solder process.
Thermal and Mechanical Design Guidelines 101