Packaging Information - Cypress CapSense CY8C20396 Specification Sheet

CY8C20x36/46/66, CY8C20396

Packaging Information

This section illustrates the packaging specifications for the CY8C20x36/46/66, CY8C20396 PSoC device, along with the thermal
impedances for each package.
Important Note Emulation tools may require a larger area on the target PCB than the chip's footprint. For a detailed description of
the emulation tools' dimensions, refer to the document titled PSoC Emulator Pod Dimensions at
http://www.cypress.com/design/MR10161.
Figure 14. 16-Pin Chip On Lead 3x3 mm (Sawn)
001-09116 *D
Figure 15. 24-Pin (4x4 x 0.6 mm) QFN
001-13937 *B
Document Number: 001-12696 Rev. *D Page 26 of 34
[+] Feedback