Evaluation Module Overview; Introduction; Kit Contents; Specification - Texas Instruments BoosterPack BOOSTXL-IOLINKM-8 EVM User Manual

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1 Evaluation Module Overview

1.1 Introduction

This BoosterPack contains all of the analog circuitry needed to create an eight-port IO-Link Master when
combined with the LP-AM243 LaunchPad containing the processor and framehandler. Each identical port
contains a M12 connector with an IO-Link communication line (CQ), a 24-V power supply (L+) with a power
supply return or ground (L-), and a digital input line (DI).
Each port uses an IO-Link TIOL112 transceiver configured for master-mode, which implements the physical
layer interface for an IO-Link Master interface, including the required integrated current sink on the CQ line.
The TIOL112 offers a current limit of 700mA during the wake-up pulse, which exceeds the minimum 500-mA
requirement, but not enough to overload the cables or power supplies and generate fault conditions. The
TIOL112 also limits the slew rate of the CQ line to minimize overshoots, reduce emissions and improve
communication while still achieving COM3 performance with 230 kbps data rates.
The eight 24-V power supply channels are implemented with two TPS274160 quad-channel high side switches
offering individual current monitoring and a configurable current limit to protect against overloaded outputs and
fault conditions.
An eight-channel, 24-V, SN65HVS883 digital input serializer is used to monitor the Digital Input (DI) pins of each
port when read by the processor as well as drive blue Status LEDs to reflect the line values.
General port status is provided by the processor through red and green status LEDs on each port controlled by a
TCA6424A I2C-to-GPIO Expander.
The BoosterPack is protected from over-voltage, under-voltage, over-current, reverse polarity and other fault
conditions on the primary 24-V power supply through the TPS26631 eFuse. The supply current is also monitored
for diagnostic use by the processor.
A 3.3-V digital voltage rail is created from the 24-V supply with an LMR36503 DC/DC buck converter allowing
the entire BoosterPack board to be powered from the single 24-V power supply. However, the 3.3-V supply from
the LaunchPad could be used instead with a simple jumper configuration.

1.2 Kit Contents

• EVM Board (Qty 1)
• M12 Connector Stiffener Plate (Qty 1)
• M2.5x0.45 Pan Head Machine Screw (Qty 5)

1.3 Specification

1. Texas Instruments, IO-Link Master Demo
2. Texas Instruments, TIOL112 and TIOL112x IO-Link Device Transceivers with Low Residual Voltage
andIntegrated Surge Protection in Small Packages
3. Texas Instruments, AM243x Sitara™ Microcontrollers
4. IO-Link Interface and System Specification V1.1.3
5. IO-Link Test Specification V1.1.3
SLLU357 – MAY 2023
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Evaluation Module Overview
BOOSTXL-IOLINKM-8 EVM User's Guide 3