Assembly Instructions; What To Do And What Not To Do - Texas Instruments BoosterPack BOOSTXL-IOLINKM-8 EVM User Manual

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2.7 Assembly Instructions

Figure 2-12 shows the complete mechanical assembly of all three boards in the system. The M12 Connector
mechanical stiffener plate is the top board in the assembly and is assembled on the primary BOOSTXL-
IOLINKM-8 board. Then this BOOSTXL-IOLINKM-8 assembly is assembled onto the LaunchPad board
represented by the LP-AM243 LaunchPad board in
Figure 2-12. BoosterPack and LunchPad Mechanical Assembly

2.8 What to Do and What Not to Do

• Make sure all boards are firmly seated but not such that any other components between the LaunchPad and
BoosterPack are touching and creating possible electrical shorts.
• Always make sure the LaunchPad is powered up properly prior before the BoosterPack is powered in order
to avoid damaging the GPIO and ADC input pins on the LaunchPad. Placing the shunt jumper between
the pins labeled "3V3_LP" and "24V_SHDN" on Header J8 will disable the 24V supply rail output of the
TP26631 eFuse when there is no voltage coming from the 3V3_LP (LaunchPad) supply rail. This is the
default configuration and should protect the LaunchPad MCU by disabling the BOOSTXL-IOLINKM-8 when
the LaunchPad is not properly powered.
• Be aware that some of the signals on this board are of a 24-V level, and others are of a 3.3-V or 5-V level.
Be careful when working with the board to avoid connecting or shorting two signals of different levels together
which may result in damage to the board.
SLLU357 – MAY 2023
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Figure 2-12.
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BOOSTXL-IOLINKM-8 EVM User's Guide
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