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Evaluation Module Overview
1 Evaluation Module Overview
1.1 Introduction
The CC3301 BoosterPack
connected to TI LaunchPad
This user's guide is intended to explain the various hardware configurations and features of the BP-CC3301. For
more information about the CC3301 device, please refer to ti.com
1.2 Kit Contents
•
One BP-CC3301 Board
•
EVM disclaimer Read Me
1.3 Specification
The BP-CC3301 is a board designed to enable rapid and easy software and hardware development for the
CC3301 device. The block diagram for the BP-CC3301 is shown below.
This kit can be used in three configurations:
1. MCU and RTOS evaluation: BP-CC3301 + LaunchPad with the MCU running TCP/IP like the LP-AM243.
2. Processor and Linux evaluation: BP-CC3301 + BP-CC33-BBB-ADAPT + BEAGL-BONE-BLACK.
3. RF-testing with PC tools: BP-CC3301 + LP-XDS110.
In addition, the BP-CC3301 can also be wired to any other Linux or RTOS host board running TCP/IP stack.
Refer to
Section 3
for more information.
1.4 Device Information
The purpose of the BP-CC3301 is to showcase the hardware and software capabilities of the CC3301 device.
The other components on the board are populated for testing and support of this main device.
2 Hardware
Figure 2-1
shows the overview of the BP-CC3301.
™
4
SimpleLink
CC3301 Wi-Fi 6 and Bluetooth
in Module (BP-CC3301)
™
plug-in module (BP-CC3301) is a test and development board that can easily be
™
or processor boards; thus enabling rapid software development.
Figure 1-1. BP-CC3301 Block Diagram
®
Low Energy BoosterPack
Copyright © 2023 Texas Instruments Incorporated
CC3301
product folder.
™
Plug-
www.ti.com
SWAU130 – MARCH 2023
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