Packaging - Quectel BG772A-GL Hardware Design

Table 42: Recommended Thermal Profile Parameters
Factor
Soak Zone
Max slope
Soak time (between A and B: 150 °C and 200 °C)
Reflow Zone
Max slope
Reflow time (D: over 220 °C)
Max temperature
Cooling down slope
Reflow Cycle
Max reflow cycle
NOTE
If a conformal coating is necessary for the module, do NOT use any coating material that may chemically
react with the PCB or shielding cover, and prevent the coating material from flowing into the module.

8.3. Packaging

BG772A-GL is packaged in a vacuum-sealed bag which is ESD protected. The bag should not be opened
until the devices are ready to be soldered onto the application.
The following figures show the packaging details, measured in millimetre (mm).
BG772A-GL_Hardware_Design
BG772A-GL Hardware Design
Recommendation
1 to 3 °C/s
70 to 120 s
2 to 3 °C/s
45 to 70 s
238 to 246 °C
-1.5 to -3 °C/s
1
LPWA Module Series
74 / 75