Siemens SIMATIC IPC647E Operating Instructions Manual page 163

Number of the slot, Specification slot
See Rear of the de-
vice (Page 21)
① PCI
•
•
④ PCI
•
•
③ PCIe x16
•
•
② PCIe x16
•
•
M.2 NVMe
⑤
•
•
•
For information on the host device, refer to: "Interrupt assignment of expansion card slots
1
on the bus board (Page 186)".
Mounting position for optional graphics card
③ Piggyback slot 3
Installation position for hardware Raid adapter card
② Piggyback slot 2
Mounting position for optional AI Unit NVIDIA A2
② Piggyback slot 2 (slot 3 cannot be used)
SIMATIC IPC647E
Operating Instructions, 09/2022, A5E52254141-AA
1
• 5 V; 5 A or 3.3 V; 7 A
Rev. 2.3
• 12 V; 0.5 A
PCI bus primary
• 3.3 V
Rev. 2.3
PCI bus primary
• 3.3 V; 3 A
Gen. 3
• 12 V; 2.1 A
Active lanes: 8
• 3.3 V
Gen. 3
Active lanes: 8
PCIe
Gen. 3
Active lanes: 4
8.8 Technical specifications of the expansion card slots
Maximum current consumption
Power loss per slot at max. ambient air temperature
50 °C, permissible:
≤ 30 W
; 0.2 A
aux
• Ambient temperature: Up to max. 50 °C
Power loss all slots, permitted:
≤ 55 W (for devices with drive cage type A)
≤ 30 W (for devices with drive cage type B)
• Ambient temperature: Up to max. 45 °C
; 0.4 A
aux
Power loss all slots, permitted:
≤ 55 W (for devices with drive cage type A)
≤ 55 W (for devices with drive cage type B)
• Power loss of all slots at max. ambient air tem-
perature 35 °C, permissible:
≤ 75 W (for devices with drive cage type A)
≤ 75 W for SATA, HDD/SSD
(for devices with drive cage type B)
≤ 55 W for SATA Enterprise
(for devices with drive cage type B)
n total, the power must not exceed 3.3 Vaux /
1.2 A.
Technical specifications
163