Outline; Package Components - Renesas R0E3308B0EPB00 User Manual

R0E3308B0EPB00 User's Manual

1. Outline

This chapter describes the package components, the system configuration and the preparation for using this product for the first
time.

1.1 Package Components

The R0E3308B0EPB00 package consists of the following items. When unpacking it, check to see if your R0E3308B0EPB00
contains all of these items.
Table 1.1 Package components
Item
R0E3308B0EPB00
OSC-3 (16MHz)
OSC-2
R0E3308B0EPB00 Supplementary Document
R0E3308B0EPB00 Supplementary Document
R0E3308B0EPB00 User's Manual
R0E3308B0EPB00 User's Manual
CD-ROM
* Please keep the R0E3308B0EPB00's packing box and cushion material in your place for reuse at a later time when sending
your product for repair or other purposes. Always use these packing box and cushion material when transporting this
product.
* If there is any question or doubt about the packaged product, contact your local distributor.
Note:
To our customers,
On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corp., and Renesas
Electronics Corporation took over all the business of both companies. Therefore, although the old
company name remains in this product, it is a valid Renesas Electronics product. We appreciate your
understanding.
R20UT0210EJ0200 Rev.2.00
Sep 16, 2010
Description
Emulation probe
Oscillator circuit board
Oscillator circuit bare board
English
Japanese
This manual
Japanese
MCU file/firmware installer
Quantity
1
1
1
1
1
1
1
1
April 1st, 2010
Renesas Electronics Corporation
1. Outline
Page 14 of 98