Key Features - Quectel SC200R Series Hardware Design

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SC200R is a series of SMD type modules, which can be embedded into applications through its 274 pins,
including 146 LCC pins and 128 LGA pins. With a compact profile of 40.5 mm × 40.5 mm × 2.8 mm, the
module can meet almost all requirements for M2M applications such as edge device, edge computing,
CPE, wireless POS, smart metering, router, data card, automotive, smart phone, digital signage, alarm
panel, security and industry PDA, etc.

2.2. Key Features

The following table describes the detailed features of SC200R series module.
Table 7: Key Features
Feature
Application Processor
Modem DSP
GPU
Memory
Operating System
Power Supply
Transmitting Power
SC200R&SC262R_Series_Hardware_Design
Details
64-bit quad-core ARM Cortex-A53 microprocessor, up to 1.3 GHz
512 KB L2 cache
Hexagon DSP v56 core, up to 691 MHz
768 KB L2 cache
TM
Adreno
308 GPU with 64-bit addressing, up to 485 MHz
8 GB eMMC + 1 GB LPDDR3 (default)
16 GB eMMC + 2 GB LPDDR3 (optional)
Android 10
Supply voltage: 3.55–4.2 V
Typical supply voltage: 3.8 V
Class 4 (33 dBm ± 2 dB) for GSM850
Class 4 (33 dBm ± 2 dB) for EGSM900
Class 1 (30 dBm ± 2 dB) for DCS1800
Class 1 (30 dBm ± 2 dB) for PCS1900
Class E2 (27 dBm ± 3 dB) for GSM850 8-PSK
Class E2 (27 dBm ± 3 dB) for EGSM900 8-PSK
Class E2 (26 dBm ± 3 dB) for DCS1800 8-PSK
Class E2 (26 dBm ± 3 dB) for PCS1900 8-PSK
Class 3 (24 dBm +1/-3 dB) for WCDMA bands
Class 3 (24 dBm +3/-1 dB) for EVDO/CDMA BC0
Class 3 (23 dBm ± 2 dB) for LTE-FDD bands
Class 3 (23 dBm ± 2 dB) for LTE-TDD bands
Smart Module Series
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Sc262r series

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