Quectel SC200R Series Hardware Design page 117

NOTES
1)
1. This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is
recommended to start the solder reflow process within 24 hours after the package is removed if the
temperature and moisture do not conform to, or are not sure to conform to IPC/JEDEC J-STD-033.
And do not remove the packages of tremendous modules if they are not ready for soldering.
2. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to
the air is forbidden.
3. Take out the module from the package and put it on high-temperature-resistant fixtures before baking.
All modules must be soldered to PCB within 24 hours after the baking, otherwise put them in the
drying oven. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure.
4. Pay attention to ESD protection, such as wearing anti-static gloves, when touching the modules.
9.2. Manufacturing and Soldering
Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the
stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly
so as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the
thickness of stencil for the module is recommended to be 0.18–0.20
document [4].
The peak reflow temperature should be 235–246 º C, with 246 º C as the absolute maximum reflow
temperature. To avoid damage to the module caused by repeated heating, it is strongly recommended
that the module should be mounted only after reflow soldering for the other side of PCB has been
completed. The recommended reflow soldering thermal profile (lead-free reflow soldering) and related
parameters are shown below.
SC200R&SC262R_Series_Hardware_Design
Smart Module Series
mm. For more details, see
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