Configuration 2; Heatsink/Processor; 1Preparing The System For Processor Removal - HP xw4000 Service & Reference Manual

Removal and Replacement Procedures System Board with Major Components

12.1.2 Configuration 2

This board is identified by the presence of a fansink over the primary processor. The system
board part number is 339100-xxx.

12.2 Heatsink/Processor

The processor(s) in these systems may be upgraded by replacing it with a faster component. The
hp workstation xw6000 systems may also be upgraded by adding a second processor to the
system board.
12.2.1 Preparing the System for Processor Removal
Removal of a processor requires first separating the heatsink from the processor, which are
bonded together with a compound. To break the compound bond between the heatsink and the
processor the heatsink processor assembly must be cooled or heated to the optimum temperature
as described in the following subsections:
Heatsink Cool-Down Time
Heatsink Warm-up Time
WARNING: To reduce the risk of personal injury from hot surfaces, allow the internal system
Å
components to cool before touching them.
CAUTION: Installing the processor incorrectly may cause damage to the processor and/or system
Ä
board. Processor removal and replacement should be performed by qualified personnel. Read all
instructions carefully before beginning the procedure.
CAUTION: Electrostatic discharge (ESD) can damage electronic components. Before beginning these
Ä
procedures discharge your body by touching a ground metal object. Use of a grounding strap is
recommended when handling system boards and/or electronic components. Review static discharge
information and procedures in chapter 6.
12–2
fansink
Service Reference Guide