Table of Contents
1 Board Overview......................................................................................................................................................................
Contents........................................................................................................................................................................3
1.2 Features.............................................................................................................................................................................
1.3 Specifications.....................................................................................................................................................................
LaunchPad..........................................................................................................................................4
1.5 BoosterPacks.....................................................................................................................................................................
1.6 Hardware Revisions...........................................................................................................................................................
2 Software Development...........................................................................................................................................................
Packages............................................................................................................................................5
Description.............................................................................................................................................................9
Interface................................................................................................................................................................14
3.3 Alternate Routing.............................................................................................................................................................
Design.........................................................................................................................................................................16
4.1 Schematic........................................................................................................................................................................
4.2 PCB Layout......................................................................................................................................................................
4.3 BOM.................................................................................................................................................................................
5 Frequently Asked Questions...............................................................................................................................................
6 References............................................................................................................................................................................
6.1 Reference Documents.....................................................................................................................................................
Figure 4-1. Top Signal - Layer 1................................................................................................................................................
Figure 4-2. GND - Layer 2.........................................................................................................................................................
3.........................................................................................................................................................19
Shunts...............................................................................................................................................11
Table 3-5. QEP Select Table - S5..............................................................................................................................................
Trademarks
C2000
™
, and LaunchPad
All trademarks are the property of their respective owners.
™
2
C2000
F28003x Series LaunchPad
Table of Contents
Program.................................................................................................................................6
Connections..........................................................................................................................10
Dimensions......................................................................................................................21
List of Figures
Overview.......................................................................................................................1
Diagram...........................................................................................................................11
4...........................................................................................................................................20
Options..................................................................................................................22
Project.................................................................................................23
List of Tables
Specifications........................................................................................................................3
S3...................................................................................................................................12
™
, and Code Composer Studio
™
Development Kit
Copyright © 2022 Texas Instruments Incorporated
LaunchPad..........................................................................7
™
are trademarks of Texas Instruments.
www.ti.com
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SPRUJ31 - APRIL 2022
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