Texas Instruments SimpleLink CC2650F128RGZ Manual

Texas Instruments SimpleLink CC2650F128RGZ Manual

Multistandard wireless mcu
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CC2650 SimpleLink™ Multistandard Wireless MCU

1 Device Overview

1.1

Features

1
• Microcontroller
®
– Powerful ARM
Cortex
®
– EEMBC CoreMark
– Up to 48-MHz Clock Speed
– 128KB of In-System Programmable Flash
– 8KB of SRAM for Cache
– 20KB of Ultralow-Leakage SRAM
– 2-Pin cJTAG and JTAG Debugging
– Supports Over-The-Air Upgrade (OTA)
• Ultralow-Power Sensor Controller
– Can Run Autonomous From the Rest of the
System
– 16-Bit Architecture
– 2KB of Ultralow-Leakage SRAM for Code and
Data
• Efficient Code Size Architecture, Placing Drivers,
®
Bluetooth
Low Energy Controller, IEEE 802.15.4
MAC, and Bootloader in ROM
• RoHS-Compliant Packages
– 4-mm × 4-mm RSM VQFN32 (10 GPIOs)
– 5-mm × 5-mm RHB VQFN32 (15 GPIOs)
– 7-mm × 7-mm RGZ VQFN48 (31 GPIOs)
• Peripherals
– All Digital Peripheral Pins Can Be Routed to
Any GPIO
– Four General-Purpose Timer Modules
(Eight 16-Bit or Four 32-Bit Timers, PWM Each)
– 12-Bit ADC, 200-ksamples/s, 8-Channel Analog
MUX
– Continuous Time Comparator
– Ultralow-Power Analog Comparator
– Programmable Current Source
– UART
– 2× SSI (SPI, MICROWIRE, TI)
– I2C
– I2S
– Real-Time Clock (RTC)
– AES-128 Security Module
– True Random Number Generator (TRNG)
– 10, 15, or 31 GPIOs, Depending on Package
Option
– Support for Eight Capacitive-Sensing Buttons
– Integrated Temperature Sensor
• External System
– On-Chip internal DC-DC Converter
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
Sample &
Product
Buy
Folder
®
-M3
Score: 142
Tools &
Technical
Software
Documents
SWRS158B – FEBRUARY 2015 – REVISED JULY 2016
– Very Few External Components
– Seamless Integration With the SimpleLink™
CC2590 and CC2592 Range Extenders
– Pin Compatible With the SimpleLink CC13xx in
4-mm × 4-mm and 5-mm × 5-mm VQFN
Packages
• Low Power
– Wide Supply Voltage Range
Normal Operation: 1.8 to 3.8 V
External Regulator Mode: 1.7 to 1.95 V
– Active-Mode RX: 5.9 mA
– Active-Mode TX at 0 dBm: 6.1 mA
– Active-Mode TX at +5 dBm: 9.1 mA
– Active-Mode MCU: 61 µA/MHz
– Active-Mode MCU: 48.5 CoreMark/mA
– Active-Mode Sensor Controller: 8.2 µA/MHz
– Standby: 1 µA (RTC Running and RAM/CPU
Retention)
– Shutdown: 100 nA (Wake Up on External
Events)
• RF Section
– 2.4-GHz RF Transceiver Compatible With
Bluetooth Low Energy (BLE) 4.2 Specification
and IEEE 802.15.4 PHY and MAC
– Excellent Receiver Sensitivity (–97 dBm for BLE
and –100 dBm for 802.15.4), Selectivity, and
Blocking Performance
– Link budget of 102 dB/105 dB (BLE/802.15.4)
– Programmable Output Power up to +5 dBm
– Single-Ended or Differential RF Interface
– Suitable for Systems Targeting Compliance With
Worldwide Radio Frequency Regulations
ETSI EN 300 328 (Europe)
EN 300 440 Class 2 (Europe)
FCC CFR47 Part 15 (US)
ARIB STD-T66 (Japan)
• Tools and Development Environment
– Full-Feature and Low-Cost Development Kits
– Multiple Reference Designs for Different RF
Configurations
– Packet Sniffer PC Software
– Sensor Controller Studio
– SmartRF™ Studio
– SmartRF Flash Programmer 2
– IAR Embedded Workbench
– Code Composer Studio™
Support &
Reference
Community
Design
CC2650
®
for ARM

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Summary of Contents for Texas Instruments SimpleLink CC2650F128RGZ

  • Page 1: Device Overview

    Sample & Support & Reference Product Tools & Technical Community Design Folder Software Documents CC2650 SWRS158B – FEBRUARY 2015 – REVISED JULY 2016 CC2650 SimpleLink™ Multistandard Wireless MCU 1 Device Overview Features – Very Few External Components • Microcontroller ® ®...
  • Page 2: Applications

    5.00 mm × 5.00 mm CC2650F128RSM VQFN (32) 4.00 mm × 4.00 mm (1) For more information, see Section 9, Mechanical Packaging and Orderable Information. Device Overview Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650...
  • Page 3: Functional Block Diagram

    Temp. / batt. monitor Constant current source 32 ch. µDMA Time-to-digital converter 2KB SRAM DC-DC converter Copyright © 2016, Texas Instruments Incorporated Figure 1-1. Block Diagram Device Overview Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links:...
  • Page 4: Table Of Contents

    5.19 Temperature Sensor Mechanical Packaging and Orderable ........5.20 Battery Monitor ..........Information ....... 5.21 Continuous Time Comparator ......Packaging Information ....5.22 Low-Power Clocked Comparator Table of Contents Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650...
  • Page 5: Revision History

    • Clarified Brown Out Detector status and functionality in the Power Modes table............• Added application circuit schematics and layout for 5XD and 4XS Revision History Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650...
  • Page 6: Device Comparison

    TI Designs include schematic or block diagrams, BOMs and design files to speed your time to market. Search and download designs at ti.com/tidesigns. Device Comparison Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650...
  • Page 7: Terminal Configuration And Functions

    Digital I/O GPIO (1) See technical reference manual (listed in Section 8.3) for more details. (2) Do not supply external circuitry from this pin. Terminal Configuration and Functions Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650...
  • Page 8 (3) If internal DC-DC is not used, this pin is supplied internally from the main LDO. (4) If internal DC-DC is not used, this pin must be connected to VDDR for supply from the main LDO. Terminal Configuration and Functions Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links:...
  • Page 9: Pin Diagram - Rhb Package

    JTAG TCKC (1) See technical reference manual (listed in Section 8.3) for more details. (2) Do not supply external circuitry from this pin. Terminal Configuration and Functions Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650...
  • Page 10 (3) If internal DC-DC is not used, this pin is supplied internally from the main LDO. (4) If internal DC-DC is not used, this pin must be connected to VDDR for supply from the main LDO. Terminal Configuration and Functions Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links:...
  • Page 11: Pin Diagram - Rsm Package

    Positive RF output signal to PA during TX (1) See technical reference manual (listed in Section 8.3) for more details. (2) Do not supply external circuitry from this pin. Terminal Configuration and Functions Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650...
  • Page 12 (3) If internal DC-DC is not used, this pin is supplied internally from the main LDO. (4) If internal DC-DC is not used, this pin must be connected to VDDR for supply from the main LDO. Terminal Configuration and Functions Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links:...
  • Page 13: Specifications

    Operating supply voltage VDDS For operation in battery-powered and 3.3-V systems (internal DC-DC can be used to minimize power Operating supply voltages 0.7 × VDDS, min 1.8 consumption) VDDS2 and VDDS3 Specifications Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650...
  • Page 14: Power Consumption Summary

    Flash page/sector erase time Flash write time 4 bytes at a time µs (1) This number is dependent on Flash aging and will increase over time and erase cycles. Specifications Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650...
  • Page 15: 1-Mbps Gfsk (Bluetooth Low Energy Technology) - Rx

    (2) X / Y, where X is +N MHz and Y is –N MHz. (3) Excluding one exception at F / 2, per Bluetooth Specification. wanted Specifications Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650...
  • Page 16: 1-Mbps Gfsk (Bluetooth Low Energy Technology) - Tx

    (2) X / Y, where X is +N MHz and Y is –N MHz. (3) Excluding one exception at F / 2, per Bluetooth Specification. wanted Specifications Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650...
  • Page 17: 2-Mbps Gfsk (Bluetooth 5) - Tx

    ±10 MHz and above, BER = 10 (1) Numbers given as I/C dB. (2) X / Y, where X is +N MHz and Y is –N MHz. Specifications Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650...
  • Page 18: 5-Mbps (Proprietary) - Tx

    (1) Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan). Specifications Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links:...
  • Page 19: Ieee 802.15.4 (Offset Q-Psk Dsss, 250 Kbps) - Rx

    Output power, highest setting ended 50-Ω load Output power, lowest setting Delivered to a single-ended 50-Ω load through a balun –21 Error vector magnitude At maximum output power Specifications Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650...
  • Page 20: 24-Mhz Crystal Oscillator (Xosc_Hf)

    (2) Includes initial tolerance of the crystal, drift over temperature, ageing and frequency pulling due to incorrect load capacitance. As per Bluetooth and IEEE 802.15.4 specification. Specifications Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650...
  • Page 21: 48-Mhz Rc Oscillator (Rcosc_Hf)

    (3) No missing codes. Positive DNL typically varies from +0.3 to +3.5, depending on device (see Figure 5-25). (4) For a typical example, see Figure 5-26. Specifications Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650...
  • Page 22 Input Impedance impedance depends on sampling frequency and sampling >1 MΩ time (5) Applied voltage must be within absolute maximum ratings (Section 5.1) at all times. Specifications Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650...
  • Page 23: Temperature Sensor

    Step from –10 mV to 10 mV 0.72 µs Current consumption when enabled µA (1) Additionally, the bias module must be enabled when running in standby mode. Specifications Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650...
  • Page 24: Low-Power Clocked Comparator

    Device operating as MASTER clk_high clk_per (SSIClk low time) Device operating as MASTER clk_low clk_per (1) Refer to SSI timing diagrams Figure 5-1, Figure 5-2, and Figure 5-3. Specifications Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650...
  • Page 25 Figure 5-1. SSI Timing for TI Frame Format (FRF = 01), Single Transfer Timing Measurement SSIClk SSIFss SSITx 8-bit control SSIRx 4 to 16 bits output data Figure 5-2. SSI Timing for MICROWIRE Frame Format (FRF = 10), Single Transfer Specifications Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650...
  • Page 26: Dc Characteristics

    IH = 1, transition voltage for input read as 1 → 0 0.74 with hysteresis GPIO input hysteresis IH = 1, difference between 0 → 1 and 1 → 0 points 0.33 Specifications Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650...
  • Page 27: Thermal Resistance Characteristics

    JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages. • JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements. Power dissipation of 2 W and an ambient temperature of 70ºC is assumed. Specifications Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650...
  • Page 28: Timing Requirements

    = 3.0 V, unless otherwise noted. PARAMETER TEST CONDITIONS UNIT WAKEUP AND TIMING Idle → Active µs Standby → Active µs Shutdown → Active 1015 µs Specifications Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650...
  • Page 29: Typical Characteristics

    2440 2450 2460 2470 2480 Frequency (MHz) Frequency (MHz) D019 D020 Figure 5-8. IEEE 802.15.4 Sensitivity vs Channel Frequency Figure 5-9. BLE Sensitivity vs Channel Frequency Specifications Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650...
  • Page 30 -40 -30 -20 -10 Voltage (V) Temperature (qC) D016 D001 Figure 5-14. RX Mode Current vs Supply Voltage (VDDS) Figure 5-15. RX Mode Current Consumption vs Temperature Specifications Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650...
  • Page 31 Figure 5-20. SoC ADC Effective Number of Bits vs Input Figure 5-21. SoC ADC Output vs Supply Voltage (Fixed Input, Frequency (Internal Reference, No Scaling) Internal Reference, No Scaling) Specifications Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650...
  • Page 32 Figure 5-23. SoC ADC ENOB vs Sampling Frequency Internal Reference, No Scaling) (Input Frequency = FS / 10) Temperature (qC) D021 Figure 5-24. Standby Mode Supply Current vs Temperature Specifications Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650...
  • Page 33 800 1000 1200 1400 1600 1800 2000 2200 2400 2600 2800 3000 3200 3400 3600 3800 4000 4200 ADC Code D011 Figure 5-26. SoC ADC INL vs ADC Code (Internal Reference, No Scaling) Specifications Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650...
  • Page 34: Detailed Description

    C digital sensor IF Temp. / batt. monitor Constant current source 32 ch. µDMA Time-to-digital converter 2KB SRAM DC-DC converter Copyright © 2016, Texas Instruments Incorporated Detailed Description Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650...
  • Page 35: Main Cpu

    The RF core has a dedicated 4-KB SRAM block and runs initially from separate ROM memory. The ARM Cortex-M0 processor is not programmable by customers. Detailed Description Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650...
  • Page 36: Sensor Controller

    Quadrature decoder for polling rotation sensors • Oscillator calibration NOTE Texas Instruments provides application examples for some of these use cases, but not for all of them. The peripherals in the Sensor Controller include the following: • The low-power clocked comparator can be used to wake the device from any state in which the comparator is active.
  • Page 37: Memory

    SPI or UART. Debug The on-chip debug support is done through a dedicated cJTAG (IEEE 1149.7) or JTAG (IEEE 1149.1) interface. Detailed Description Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650...
  • Page 38: Power Management

    CPU can differentiate between a reset in this way, a reset-by-reset pin, or a power-on-reset by reading the reset status register. The only state retained in this mode is the latched I/O state and the Flash memory contents. Detailed Description Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650...
  • Page 39: Clock Systems

    The watchdog timer is used to regain control if the system fails due to a software error after an external device fails to respond as expected. The watchdog timer can generate an interrupt or a reset when a predefined time-out value is reached. Detailed Description Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650...
  • Page 40: Voltage Supply Domains

    In the first case, the external host MCU communicates with the device using SPI or UART. In the second case, the application must be written according to the application framework supplied with the wireless protocol stack. Detailed Description Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650...
  • Page 41: Application, Implementation, And Layout

    15 nH 2 nH Pin 1 (RF P) 12 pF 1.2 pF 1.2 pF Copyright © 2016, Texas Instruments Incorporated Figure 7-1. CC2650 Application Circuit Application, Implementation, and Layout Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links:...
  • Page 42 1.8 V±3.8 V 1.8 V±3.8 V to All VDDS Pins Supply Voltage To All VDDS Pins Copyright © 2016, Texas Instruments Incorporated Figure 7-2. Supply Voltage Configurations Application, Implementation, and Layout Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback...
  • Page 43: External Differential (5Xd) Application Circuit

    CC2650F128RHB 24 MHz 32.768 kHz 12 pF 12 pF Copyright © 2016, Texas Instruments Incorporated Figure 7-3. 5 × 5 External Differential (5XD) Application Circuit Application, Implementation, and Layout Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links:...
  • Page 44 CC2650 SWRS158B – FEBRUARY 2015 – REVISED JULY 2016 www.ti.com 7.2.1 Layout Figure 7-4. 5 × 5 External Differential (5XD) Layout Application, Implementation, and Layout Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650...
  • Page 45: External Single-Ended (4Xs) Application Circuit

    CC26XX_4X4 24 MHz 32.768 kHz 12 pF 12 pF Copyright © 2016, Texas Instruments Incorporated Figure 7-5. 4 × 4 External Single-ended (4XS) Application Circuit Application, Implementation, and Layout Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links:...
  • Page 46 CC2650 SWRS158B – FEBRUARY 2015 – REVISED JULY 2016 www.ti.com 7.3.1 Layout Figure 7-6. 4 × 4 External Single-ended (4XS) Layout Application, Implementation, and Layout Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650...
  • Page 47: Device And Documentation Support

    Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.
  • Page 48: Tools And Software

    • RTOS plugin available for TI-RTOS For a complete listing of development-support tools for the CC2650 platform, visit the Texas Instruments website at www.ti.com. For information on pricing and availability, contact the nearest TI field sales office or authorized distributor.
  • Page 49: Documentation Support

    Errata CC2630 and CC2650 SimpleLink™ Wireless MCU Errata Texas Instruments Low-Power RF Website Texas Instruments' Low-Power RF website has all the latest products, application and design notes, FAQ section, news and events updates. Go to www.ti.com/lprf. Low-Power RF eNewsletter The Low-Power RF eNewsletter is up-to-date on new products, news releases, developers’ news, and other news and events associated with low-power RF products from TI.
  • Page 50: Additional Information

    All other trademarks are the property of their respective owners. Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
  • Page 51 PACKAGE OPTION ADDENDUM www.ti.com 30-Nov-2015 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples Drawing (4/5) CC2650F128RGZR ACTIVE VQFN 2500 Green (RoHS CU NIPDAU | Call TI Level-3-260C-168 HR -40 to 85 CC2650...
  • Page 52 PACKAGE OPTION ADDENDUM www.ti.com 30-Nov-2015 Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.
  • Page 53 PACKAGE MATERIALS INFORMATION www.ti.com 30-Nov-2015 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Reel Reel Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1 (mm) CC2650F128RGZR VQFN 2500 330.0 16.4 12.0 16.0 CC2650F128RGZT VQFN 180.0...
  • Page 54 PACKAGE MATERIALS INFORMATION www.ti.com 30-Nov-2015 *All dimensions are nominal Device Package Type Package Drawing Pins Length (mm) Width (mm) Height (mm) CC2650F128RGZR VQFN 2500 367.0 367.0 38.0 CC2650F128RGZT VQFN 210.0 185.0 35.0 CC2650F128RHBR VQFN 3000 367.0 367.0 35.0 CC2650F128RHBT VQFN 210.0 185.0 35.0...
  • Page 64 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue.
  • Page 65 IAR Embedded Workbench TI Resource Explorer Code Composer Studio 2015 Texas Instruments Incorporated. The platform bar, SmartRF, and Code Composer Studio are trademarks of Texas Instruments. All other trademarks are the property of their respective owners. Below are the pins exposed @ the CC2650 LaunchPad BoosterPack connector Also shown are functions that map with the BoosterPack pinout standard.
  • Page 66 A closer look at your new Out-of-box Find more information @ dev.ti.com/launchxl-cc2650 LaunchPad Development Kit 0. For rev 1.1 of the LaunchPad only Go to dev.ti.com/launchxl-cc2650 and upgrade the firmware via Featured wireless MCU: USB before using the LaunchPad with the Simplelink Starter app CC2650: Low-power, multi-protocol, 2.4GHz wireless MCU 1.
  • Page 67 STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein. Acceptance of the EVM is expressly subject to the following terms and conditions.
  • Page 68 FCC Interference Statement for Class B EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation.
  • Page 69 【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの 措置を取っていただく必要がありますのでご注意ください。 1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用 いただく。 2. 実験局の免許を取得後ご使用いただく。 3. 技術基準適合証明を取得後ご使用いただく。 なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。 上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ ンスツルメンツ株式会社 東京都新宿区西新宿6丁目24番1号 西新宿三井ビル 3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page 電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page SPACER EVM Use Restrictions and Warnings: 4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
  • Page 70 Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief in any United States or foreign court. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2015, Texas Instruments Incorporated...
  • Page 71 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue.

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